Interfacial Reaction and IMC Growth of an Ultrasonically Soldered Cu/SAC305/Cu Structure during Isothermal Aging

Performance of Sn–3.0Ag–0.5Cu composite solder with TiC reinforcement: Physical properties, solderability and microstructural evolution under isothermal ageing

(2016) Guang Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Influence of high-power-low-frequency ultrasonic vibration time on the microstructure and mechanical properties of lead-free solder joints

(2016) Ai Ting Tan et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Effects of ultrasonic treatment on microstructure and mechanical properties of semisolid Sn-52Bi alloy

(2016) Yongjun Hu et al.   JOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION

Rapid formation of intermetallic joints through ultrasonic-assisted die bonding with Sn–0.7Cu solder for high temperature packaging application

(2016) Hongjun Ji et al.   SCRIPTA MATERIALIA

Microstructure and mechanical properties of Pb-free Sn–3.0Ag–0.5Cu solder pastes added with NiO nanoparticles after reflow soldering process

(2016) Srivalli Chellvarajoo et al.   MATERIALS & DESIGN

Interfacial reaction behavior and mechanical properties of ultrasonically brazed Cu/Zn–Al/Cu joints

(2015) Yong Xiao et al.   MATERIALS & DESIGN

Effect of ageing time on the tensile behavior of Sn–3.5wt% Ag–0.5wt% Cu (SAC355) solder alloy with and without adding ZnO nanoparticles

(2015) M. Sobhy et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Fabrication and interfacial reaction of carbon nanotube-embedded Sn–3.5Ag solder balls for ball grid arrays

(2013) Young-Ki Ko et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of aging time on the mechanical properties of Sn–9Zn–1.5Ag–xBi lead-free solder alloys

(2013) Chih-Yao Liu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging

(2013) Xiaowu Hu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of reflow on the interfacial characteristics between Zn nanoparticles containing Sn‐3.8Ag‐0.7Cu solder and copper substrate

(2013) Y.H. Chan et al.   SOLDERING & SURFACE MOUNT TECHNOLOGY

Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves

(2013) Zhuolin Li et al.   ULTRASONICS SONOCHEMISTRY

IMC growth of Sn-3.5Ag/Cu system: Combined chemical reaction and diffusion mechanisms

(2012) Ousama M. Abdelhadi et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructure and Tensile Properties of Sn-1Ag-0.5Cu Solder Alloy Bearing Al for Electronics Applications

(2012) Dhafer Abdul-Ameer Shnawah et al.   JOURNAL OF ELECTRONIC MATERIALS

Ultrasonic Cavitation at Solid Surfaces

(2011) Dmitry G. Shchukin et al.   ADVANCED MATERIALS

Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1wt% nano-TiO2 composite solder on flexible ball grid array substrates

(2011) Asit Kumar Gain et al.   MICROELECTRONICS RELIABILITY

The characterization of acoustic cavitation bubbles – An overview

(2010) Muthupandian Ashokkumar   ULTRASONICS SONOCHEMISTRY

Preparation and properties of particle reinforced Sn-Zn-based composite solder

(2009) Huizhen Huang et al.   JOURNAL OF WUHAN UNIVERSITY OF TECHNOLOGY-MATERIALS SCIENCE EDITION

Inside a Collapsing Bubble: Sonoluminescence and the Conditions During Cavitation

(2008) Kenneth S. Suslick et al.   Annual Review of Physical Chemistry

Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

(2008) Myung Jin Yim et al.   JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY