Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging

Published 2008 View Full Article

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Title
Review of Recent Advances in Electrically Conductive Adhesive Materials and Technologies in Electronic Packaging
Authors
Keywords
-
Journal
JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY
Volume 22, Issue 14, Pages 1593-1630
Publisher
Informa UK Limited
Online
2008-10-15
DOI
10.1163/156856108x320519

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