Exploring Alternative Metals to Cu and W for Interconnects Applications Using Automated First-Principles Simulations

Comprehensive Search for New Phases and Compounds in Binary Alloy Systems Based on Platinum-Group Metals, Using a Computational First-Principles Approach

(2014) Gus L. W. Hart et al.   Physical Review X

Ultrathin NiGe Films Prepared via Catalytic Solid–Vapor Reaction of Ni with GeH4

(2013) Antony P. Peter et al.   ACS Applied Materials & Interfaces

Filling Narrow Trenches by Iodine-Catalyzed CVD of Copper and Manganese on Manganese Nitride Barrier/Adhesion Layers

(2011) Yeung Au et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Scalability of plasma enhanced atomic layer deposited ruthenium films for interconnect applications

(2011) J. Swerts et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

QUANTUM ESPRESSO: a modular and open-source software project for quantum simulations of materials

(2009) Paolo Giannozzi et al.   JOURNAL OF PHYSICS-CONDENSED MATTER

Cu(ReN[sub x]) for Advanced Barrierless Interconnects Stable Up To 730°C

(2009) J. P. Chu et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Electromigration Lifetime Enhancement of CoWP Capped Cu Interconnects by Thermal Treatment

(2008) Yumi Kakuhara et al.   JAPANESE JOURNAL OF APPLIED PHYSICS