Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns

Pyridine–copper(ii) formates for the generation of high conductivity copper films at low temperatures

(2016) C. Paquet et al.   CHEMICAL COMMUNICATIONS

Synergetic Effect of Blended Alkylamines for Copper Complex Ink To Form Conductive Copper Films

(2016) Wen Xu et al.   LANGMUIR

Self-reducible copper inks composed of copper–amino complexes and preset submicron copper seeds for thick conductive patterns on a flexible substrate

(2016) Wanli Li et al.   Journal of Materials Chemistry C

Self-reducible copper ion complex ink for air sinterable conductive electrodes

(2016) Sanghun Cho et al.   Journal of Materials Chemistry C

Copper conductive lines on flexible substrates fabricated at room temperature

(2016) Cyuan-Jhang Wu et al.   Journal of Materials Chemistry C

Self-reduction of a copper complex MOD ink for inkjet printing conductive patterns on plastics

(2015) Yousef Farraj et al.   CHEMICAL COMMUNICATIONS

Effect of the Amine Concentration on Phase Evolution and Densification in Printed Films Using Cu(II) Complex Ink

(2015) Yun-Hyuk Choi et al.   LANGMUIR

A Self-Reducible and Alcohol-Soluble Copper-Based Metal–Organic Decomposition Ink for Printed Electronics

(2014) Dong-Hun Shin et al.   ACS Applied Materials & Interfaces

Copper Nanoparticles: Aqueous Phase Synthesis and Conductive Films Fabrication at Low Sintering Temperature

(2013) Dunying Deng et al.   ACS Applied Materials & Interfaces

Cu Salt Ink Formulation for Printed Electronics using Photonic Sintering

(2013) Teppei Araki et al.   LANGMUIR

Statistical Analysis of Plating Variable Effects on the Electrical Conductivity of Electroless Copper Patterns on Paper

(2012) Daniel Zabetakis et al.   ACS Applied Materials & Interfaces

Direct Writing Patterns for Electroless Plated Copper Thin Film on Plastic Substrates

(2012) Ying-Chih Liao et al.   ACS Applied Materials & Interfaces

Inkjet-Printed Gold Electrodes on Paper: Characterization and Functionalization

(2012) Anni Määttänen et al.   ACS Applied Materials & Interfaces

Fabrication of Gold Patterns via Multilayer Transfer Printing and Electroless Plating

(2012) Fevzihan Basarir   ACS Applied Materials & Interfaces

Electrically conductive copper film prepared at low temperature by thermal decomposition of copper amine complexes with various amines

(2012) Akihiro Yabuki et al.   MATERIALS RESEARCH BULLETIN

Effect of Carboxylic Acid on Sintering of Inkjet-Printed Copper Nanoparticulate Films

(2011) Kyoohee Woo et al.   ACS Applied Materials & Interfaces

Formation of conductive silver films via inkjet reaction system

(2011) Zhen-Kai Kao et al.   JOURNAL OF MATERIALS CHEMISTRY

Fabrication of paper-based conductive patterns for flexible electronics by direct-writing

(2011) Yan-Long Tai et al.   JOURNAL OF MATERIALS CHEMISTRY

Synthesis of vinyl acetate/Pd nanocomposites as activator ink for ink-jet printing technology and electroless copper plating

(2011) Chun-Chieh Tseng et al.   Journal of the Taiwan Institute of Chemical Engineers

Stable Aqueous Based Cu Nanoparticle Ink for Printing Well-Defined Highly Conductive Features on a Plastic Substrate

(2011) Sunho Jeong et al.   LANGMUIR

Low-temperature synthesis of copper conductive film by thermal decomposition of copper–amine complexes

(2011) Akihiro Yabuki et al.   THIN SOLID FILMS

A low-cure-temperature copper nano ink for highly conductive printed electrodes

(2009) Byoungyoon Lee et al.   CURRENT APPLIED PHYSICS

Conductive copper and nickel lines via reactive inkjet printing

(2009) Dapeng Li et al.   JOURNAL OF MATERIALS CHEMISTRY

Room temperature preparation of conductive silver features using spin-coating and inkjet printing

(2009) Josué J. P. Valeton et al.   JOURNAL OF MATERIALS CHEMISTRY

Inkjet-printing- and electroless-plating- based fabrication of RF circuit structures on high-frequency substrates

(2009) A Sridhar et al.   JOURNAL OF MICROMECHANICS AND MICROENGINEERING

Sintering of inkjet printed copper nanoparticles for flexible electronics

(2009) Seonhee Jang et al.   SCRIPTA MATERIALIA

Direct writing technology—Advances and developments

(2008) K.K.B. Hon et al.   CIRP ANNALS-MANUFACTURING TECHNOLOGY

Large-scale synthesis of copper nanoparticles by chemically controlled reduction for applications of inkjet-printed electronics

(2008) Youngil Lee et al.   NANOTECHNOLOGY