A low-cure-temperature copper nano ink for highly conductive printed electrodes

Title
A low-cure-temperature copper nano ink for highly conductive printed electrodes
Authors
Keywords
-
Journal
CURRENT APPLIED PHYSICS
Volume 9, Issue 2, Pages e157-e160
Publisher
Elsevier BV
Online
2009-03-14
DOI
10.1016/j.cap.2009.03.008

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