Self-reducible copper ion complex ink for air sinterable conductive electrodes

Low-Thermal-Budget Photonic Processing of Highly Conductive Cu Interconnects Based on CuO Nanoinks: Potential for Flexible Printed Electronics

(2016) Matthew S. Rager et al.   ACS Applied Materials & Interfaces

Self-reduction of a copper complex MOD ink for inkjet printing conductive patterns on plastics

(2015) Yousef Farraj et al.   CHEMICAL COMMUNICATIONS

Synthesis of Cu3Sn Alloy Nanocrystals through Sequential Reduction Induced by Gradual Increase of the Reaction Temperature

(2015) Sanghun Cho et al.   CHEMISTRY-A EUROPEAN JOURNAL

Effect of the Amine Concentration on Phase Evolution and Densification in Printed Films Using Cu(II) Complex Ink

(2015) Yun-Hyuk Choi et al.   LANGMUIR

Size-tunable and scalable synthesis of uniform copper nanocrystals

(2015) Hwansu Sim et al.   RSC Advances

Pressure-assisted electrode fabrication using simply synthesized Cu3Sn alloy nanoparticles

(2015) Sanghun Cho et al.   Journal of Materials Chemistry C

A Self-Reducible and Alcohol-Soluble Copper-Based Metal–Organic Decomposition Ink for Printed Electronics

(2014) Dong-Hun Shin et al.   ACS Applied Materials & Interfaces

Vacuum-Free, Maskless Patterning of Ni Electrodes by Laser Reductive Sintering of NiO Nanoparticle Ink and Its Application to Transparent Conductors

(2014) Daeho Lee et al.   ACS Nano

Synthesis of copper conductive film by low-temperature thermal decomposition of copper–aminediol complexes under an air atmosphere

(2014) Akihiro Yabuki et al.   MATERIALS CHEMISTRY AND PHYSICS

Merging of Kirkendall Growth and Ostwald Ripening: CuO@MnO2 Core-shell Architectures for Asymmetric Supercapacitors

(2014) Ming Huang et al.   Scientific Reports

Progress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devices

(2014) Sebastian Wünscher et al.   Journal of Materials Chemistry C

Inkjet-Printed Gold Electrodes on Paper: Characterization and Functionalization

(2012) Anni Määttänen et al.   ACS Applied Materials & Interfaces

Ethylene glycol: properties, synthesis, and applications

(2012) Hairong Yue et al.   CHEMICAL SOCIETY REVIEWS

Highly conductive polymer-decorated Cu electrode films printed on glass substrates with novel precursor-based inks and pastes

(2012) Yun-Hyuk Choi et al.   JOURNAL OF MATERIALS CHEMISTRY

Adhesion enhancement of ink-jet printed conductive copper patterns on a flexible substrate

(2012) Young-In Lee et al.   JOURNAL OF MATERIALS CHEMISTRY

Preparation, characterization and reaction mechanism of a novel silver-organic conductive ink

(2012) Yu Chang et al.   JOURNAL OF MATERIALS CHEMISTRY

A new one-pot method for the synthesis of Cu nanoparticles for low temperature bonding

(2012) Toshitaka Ishizaki et al.   JOURNAL OF MATERIALS CHEMISTRY

Effect of Carboxylic Acid on Sintering of Inkjet-Printed Copper Nanoparticulate Films

(2011) Kyoohee Woo et al.   ACS Applied Materials & Interfaces

Highly Conductive PEDOT:PSS Electrode with Optimized Solvent and Thermal Post-Treatment for ITO-Free Organic Solar Cells

(2011) Yong Hyun Kim et al.   ADVANCED FUNCTIONAL MATERIALS

Emerging Transparent Electrodes Based on Thin Films of Carbon Nanotubes, Graphene, and Metallic Nanostructures

(2011) David S. Hecht et al.   ADVANCED MATERIALS

Easy access to Cu0nanoparticles and porous copper electrodes with high oxidation stability and high conductivity

(2011) Christian Kind et al.   JOURNAL OF MATERIALS CHEMISTRY

Preparation of Elemental Cu and Ni Nanoparticles by the Polyol Method: An Experimental and Theoretical Approach

(2011) Kyler J. Carroll et al.   Journal of Physical Chemistry C

Low-temperature synthesis of copper conductive film by thermal decomposition of copper–amine complexes

(2011) Akihiro Yabuki et al.   THIN SOLID FILMS

Inkjet Printing of Conductive Silver Patterns by Using the First Aqueous Particle-Free MOD Ink without Additional Stabilizing Ligands†

(2010) Stephan F. Jahn et al.   CHEMISTRY OF MATERIALS

Materials and Devices toward Fully Solution Processable Organic Light-Emitting Diodes†

(2010) Chengmei Zhong et al.   CHEMISTRY OF MATERIALS

A Low Sintering Temperature and Electrical Performance of Nanoparticle Copper Ink for Use in Ink-Jet Printing

(2010) M. S. Cho et al.   JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY

Combined Role of Well-Dispersed Aqueous Ag Ink and the Molecular Adhesive Layer in Inkjet Printing the Narrow and Highly Conductive Ag Features on a Glass Substrate

(2010) Sunho Jeong et al.   Journal of Physical Chemistry C

Copper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation Stability

(2010) Shlomo Magdassi et al.   Materials

Inkjet Printing-Process and Its Applications

(2009) Madhusudan Singh et al.   ADVANCED MATERIALS

Conductive copper and nickel lines via reactive inkjet printing

(2009) Dapeng Li et al.   JOURNAL OF MATERIALS CHEMISTRY

Formation of air-stable copper–silver core–shell nanoparticles for inkjet printing

(2009) Michael Grouchko et al.   JOURNAL OF MATERIALS CHEMISTRY

Controlling the Thickness of the Surface Oxide Layer on Cu Nanoparticles for the Fabrication of Conductive Structures by Ink-Jet Printing

(2008) Sunho Jeong et al.   ADVANCED FUNCTIONAL MATERIALS

XPS study of the Cu@Cu2O core-shell nanoparticles

(2008) T. Ghodselahi et al.   APPLIED SURFACE SCIENCE

Inkjet-printed silver tracks: low temperature curing and thermal stability investigation

(2008) By Jolke Perelaer et al.   JOURNAL OF MATERIALS CHEMISTRY