Formation of solid-solution Cu-to-Cu joints using Ga solder and Pt under bump metallurgy for three-dimensional integrated circuits
出版年份 2015 全文链接
标题
Formation of solid-solution Cu-to-Cu joints using Ga solder and Pt under bump metallurgy for three-dimensional integrated circuits
作者
关键词
3D IC packaging, Cu-to-Cu bonding, GA-based solder, transient liquid phase (TLP) bonding, under bump metallurgy
出版物
Electronic Materials Letters
Volume 11, Issue 4, Pages 687-694
出版商
Springer Nature
发表日期
2015-06-30
DOI
10.1007/s13391-015-5015-z
参考文献
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