Tetraoxa-Diphosphaspiro Derivative as Suppressor for Microvia Filling by Copper Electroplating in Acidic Solution

Microvia Filling by Copper Electroplating Using a Modified Safranine T as a Leveler

(2017) H. P. Zhu et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Electrodeposition of copper on an Au(111) electrode modified with mercaptoacetic acid in sulfuric acid

(2016) Chao-Shan Lai et al.   ELECTROCHIMICA ACTA

Synergistic Effect of Different Additives on Microvia Filling in an Acidic Copper Plating Solution

(2016) Zhihua Tao et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Analysis of Corrosion-Induced Diffusion Layer in ZK60A Magnesium Alloy

(2016) Shumin Li et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Tetrazole Derived Levelers for Filling Electroplated Cu Microvias: Electrochemical Behaviors and Quantum Calculations

(2015) Zhanwu Lei et al.   ELECTROCHIMICA ACTA

On the Displacement of Adsorbed Polyethylene Glycol by 3-Mercapto-1-Propanesulfonate during Copper Electrodeposition

(2014) Ashleigh Kreider et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Adhesion Enhancement of a Plated Copper Layer on an AlN Substrate Using a Chemical Grafting Process at Room Temperature

(2014) Shao-Ping Shen et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Void-Free Copper Filling of Through Silicon Via by Periodic Pulse Reverse Electrodeposition

(2014) Q. S. Zhu et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effects of organic acids on through-hole filling by copper electroplating

(2013) Jhih-Jyun Yan et al.   ELECTROCHIMICA ACTA

Electrochemical behaviors of Janus Green B in through-hole copper electroplating: An insight by experiment and density functional theory calculation using Safranine T as a comparison

(2013) Chong Wang et al.   ELECTROCHIMICA ACTA

An effective triblock copolymer as a suppressor for microvia filling via copper electrodeposition

(2013) Ning Xiao et al.   ELECTROCHIMICA ACTA

Adsorption behavior of triblock copolymer suppressors during the copper electrodeposition

(2013) Ning Xiao et al.   ELECTROCHIMICA ACTA

Through-Hole Copper Electroplating Using Nitrotetrazolium Blue Chloride as a Leveler

(2013) Chong Wang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Accelerator Screening by Cyclic Voltammetry for Microvia Filling by Copper Electroplating

(2013) Yong-Da Chiu et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Triblock Copolymers as Suppressors for Microvia Filling via Copper Electroplating

(2013) Ning Xiao et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating

(2012) Nguyen T.M. Hai et al.   ELECTROCHIMICA ACTA

The Synergistic Effect between a Triblock Copolymer and Chloride Ions in Cu Electrodeposition into Microvias

(2012) N. Xiao et al.   ECS Solid State Letters

Sensitivity Enhancement for Quantitative Electrochemical Determination of a Trace Amount of Accelerator in Copper Plating Solutions

(2011) Yong-Da Chiu et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Interaction between SPS and MPS in the Presence of Ferrous and Ferric Ions

(2011) Igor Volov et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Substitutional adsorption isotherms and corrosion inhibitive properties of some oxadiazol-triazole derivative in acidic solution

(2010) Shengtao Zhang et al.   CORROSION SCIENCE

Accelerator Surface Phase Associated with Superconformal Cu Electrodeposition

(2010) T. P. Moffat et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Rapid Galvanostatic Determination on Levelers for Superfilling in Cu Electroplating

(2009) Ho-Cheng Tsai et al.   ELECTROCHEMICAL AND SOLID STATE LETTERS

The effect of some triazole derivatives as inhibitors for the corrosion of mild steel in 1M hydrochloric acid

(2008) Shengtao Zhang et al.   APPLIED SURFACE SCIENCE

Effect of Cl[sup −] on the Adsorption–Desorption Behavior of PEG

(2008) Wei Wang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY