Sensitivity Enhancement for Quantitative Electrochemical Determination of a Trace Amount of Accelerator in Copper Plating Solutions

Monitoring the Superfilling of Blind Holes with Electrodeposited Copper

(2010) O. Lühn et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Microvia filling by copper electroplating using diazine black as a leveler

(2009) Wei-Ping Dow et al.   ELECTROCHIMICA ACTA

Microvia Filling by Cu Electroplating Over a Au Seed Layer Modified by a Disulfide

(2009) Wei-Ping Dow et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Copper Fill of Microvia Using a Thiol-Modified Cu Seed Layer and Various Levelers

(2009) Wei-Ping Dow et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Filling of microvia with an aspect ratio of 5 by copper electrodeposition

(2008) O. Lühn et al.   ELECTROCHIMICA ACTA

Blocking of Disulfide Adsorption by Coadsorbing ω-Functionalized Alkane Thiols Revealed by Wet Stamping and Fluorescence Microscopy

(2008) Christopher J. Campbell et al.   LANGMUIR

3-Mercapto-1-propanesulfonic acid and Bis(3-sulfopropyl) Disulfide Adsorbed on Au(111): In Situ Scanning Tunneling Microscopy and Electrochemical Studies

(2008) Zheng-Yan Jian et al.   LANGMUIR