Article
Chemistry, Analytical
Zhihua Tao, Zhiyuan Long, Linjie Tengxu, Guanting Liu, Xuefei Tao
Summary: A nitrogen-containing heterocyclic compound named L was investigated as a new leveler for microvias Cu filling. The study found that L exhibited synergistic effects with other plating additives, leading to improved Cu filling performance. Additionally, it was observed that the absence of an accelerator in the copper plating solution could result in cracked plating in microvias, while the absence of air agitation prevented microvia super-filling.
JOURNAL OF ELECTROANALYTICAL CHEMISTRY
(2022)
Article
Chemistry, Physical
Miaomiao Zhou, Yachao Meng, Jingwei Ling, Yu Zhang, Wei Huang, Yulin Min, Xixun Shen, Qunjie Xu
Summary: A new leveling agent was proposed in this study to meet the blind holes filling requirements of high-density interconnected printed circuit boards, and its effect was studied through various analysis methods, providing inspiration for the discovery of new and effective leveling agents in the future.
APPLIED SURFACE SCIENCE
(2022)
Article
Chemistry, Multidisciplinary
Ganglong Li, Zhiyi Li, Junjie Li, Houya Wu
Summary: This study proposed a two-step method to enhance the efficiency of microvia filling by pre-setting metal particles in the microvias and reducing the amount of electroplating copper required for filling, thus shortening the electroplating period.
Article
Chemistry, Multidisciplinary
Lei Jin, Wei-Qing Li, Zhao-Yun Wang, Jia-Qiang Yang, An-Ni Zheng, Fang-Zu Yang, Dongping Zhan, De-Yin Wu, Zhong-Qun Tian
Summary: A novel citrate-based copper electronic electroplating bath containing succinimide has been developed to fill microvias in printed circuit boards, improving coating quality.
ACS SUSTAINABLE CHEMISTRY & ENGINEERING
(2022)
Article
Nanoscience & Nanotechnology
Julien Gay, Agata Lachowicz, Nicolas Blondiaux, Gaelle A. L. Andreatta
Summary: This study presents a method for nickel and copper electroplating on solar cells using phosphonic acid self-assembled monolayers as masks. The chemical functionalization and deposition method of phosphonic acid were found to strongly influence the masking properties, and the binding modes of phosphonic acid were investigated using attenuated total reflectance Fourier transform infrared spectroscopy.
ACS APPLIED NANO MATERIALS
(2022)
Article
Electrochemistry
Myung Hyun Lee, Yoonjae Lee, Jung Ah Kim, Youngkeun Jeon, Myung Jun Kim, Young Gyu Kim, Jae Jeong Kim
Summary: This study analyzes the effects of the number of quaternary ammoniums in the levelers on their suppression and synergetic or antagonistic behavior with accelerator and microvia filling. The study proposes a method to restore the behavior of the additives to obtain successful gap-filling at microvias at a two-fold higher current density.
ELECTROCHIMICA ACTA
(2022)
Article
Chemistry, Analytical
Da Jung Park, Joo-Yul Lee, Seunghoe Choe
Summary: This study reports the development of a flow cell-based electrochemical analyzer for the simple and fast determination of additive concentrations in a Cu plating bath. The proposed approach enables the fast and highly accurate determination of organic additives in a Cu electroplating solution.
JOURNAL OF ELECTROANALYTICAL CHEMISTRY
(2023)
Article
Chemistry, Multidisciplinary
Yoshiki Ozawa, Hiroki Iida, Hidetoshi Kiyooka, Kazutaka Nobori, Keishiro Tahara, Toshikazu Ono, Masaaki Abe
Summary: The new tetracopper(I) complex with a cuboidal Cu4S4 core has been synthesized and structurally characterized. The monoanionic iminothiolate ligand makes the cluster framework exceptionally stable in solution, allowing for examination of solution properties using various spectroscopic techniques.
BULLETIN OF THE CHEMICAL SOCIETY OF JAPAN
(2021)
Article
Electrochemistry
Vishant Garg, Sagar B. Sharma, Sandrine Zanna, Antoine Seyeux, Vincent Maurice, Philippe Marcus
Summary: In this study, electrochemistry and advanced surface analyzes were used to investigate the inhibition of copper corrosion by 2-mercapto-benzothiazole (2-MBT) in hydrochloric aqueous solution and the influence of electrochemical control on the formation of the inhibiting interface. The results showed that reduction of the native surface oxide prior to exposure to the inhibitor significantly decreased the rate of anodic dissolution. Increasing the exposure time to the inhibitor enhanced the protection against dissolution. 2-MBT adsorbed as multilayers and bonded to both metallic copper and residual copper oxide islands through its sulphur atoms. Partial dissociation of the molecule released exocyclic sulphur, which bonded to metallic Cu. Further dissociation released endocyclic sulphur, induced by anodic polarization, causing defects in the organic layer and compromising its barrier properties.
ELECTROCHIMICA ACTA
(2023)
Article
Energy & Fuels
Priti Singh, Sanjeev Das, Archana Mallik
Summary: In this study, the electroplating mechanism of Cu (In, Ga) Se2 quaternary thin films on FTO-glass substrates was investigated through cyclic voltammetry. Various combinations of salts were used for each stage of deposition, and an optimum deposition potential of -0.65 V was determined. It was found that single step deposition of CIGS was not feasible, and a two-stack approach was attempted.
Article
Electrochemistry
Myung Hyun Lee, Myung Jun Kim, Jae Jeong Kim
Summary: This study investigates the effects of bromide ions on the adsorption of polymeric suppressors and accelerators, as well as the influence of the concentration ratio of bromide ions and the accelerator on the bottom-up filling of microvias. Experimental results indicate that within the optimal concentration ratio range, successful Cu bottom-up filling at microvias can be achieved.
ELECTROCHIMICA ACTA
(2021)
Article
Chemistry, Physical
Pingjun Tao, Yugan Chen, Weitong Cai, Zhaoguang Meng
Summary: In a certain HDI printed circuit board, the effects of copper sulfate and sulfuric acid on the filling effect of a blind hole were investigated. Results showed that increasing copper sulfate concentration improved the filling effect while increasing sulfuric acid concentration gradually increased sag. Under appropriate electroplating conditions, a better blind hole filling effect can be achieved.
Article
Chemistry, Multidisciplinary
Yuyang Wang, Ruipeng Shen, Shuo Wang, Quanliang Chen, Chang Gu, Weiran Zhang, Guojian Yang, Qiaonan Chen, Yu-Mo Zhang, Sean Xiao-An Zhang
Summary: Inspired by biochemical reactions, a new electrochromic mechanism was proposed based on metal-ligand interactions for color conversion of dyes. The system combines electrochemical stability of metal ions with color adjustability of dyes, achieving high transmittance change and broad color tunability in EC devices.
Article
Chemistry, Analytical
Kechen Zhao, Jiwen Zhao, Xiaoyun Wei, Xiaoyu Guan, Chaojun Deng, Bing Dai, Jiaqi Zhu
Summary: Three-dimensional integrated packaging with through-silicon vias (TSV) can meet the requirements of high-speed computation, high-density storage, low power consumption, and compactness. This paper reports an innovative bottom-up Cu electroplating technique with a high-aspect-ratio through-diamond vias (TDV). The experimental results demonstrate the promising application of the fabricated TDV in the thermal management of advanced packaging systems.
Article
Materials Science, Multidisciplinary
Hong-Yang Wang, Guo-Hua Zhang, Kuo-Chih Chou
Summary: By using CaS as a sulfurization agent, this study successfully produced Cu-Fe-S matte with low iron content and high copper grade, providing a new approach for the production of metallic copper.
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T
(2021)