Multiphysics coupling simulation of RDE for PCB manufacturing

Adsorption behavior of triblock copolymer suppressors during the copper electrodeposition

(2013) Ning Xiao et al.   ELECTROCHIMICA ACTA

Triblock Copolymers as Suppressors for Microvia Filling via Copper Electroplating

(2013) Ning Xiao et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Kinetic and hydrodynamic implications of 1-D and 2-D models for copper electrodeposition under mixed kinetic-mass transfer control

(2012) Jorge Vazquez-Arenas et al.   ELECTROCHIMICA ACTA

Comparison between CFD calculations of the flow in a rotating disk cell and the Cochran/Levich equations

(2012) A. Alexiadis et al.   JOURNAL OF ELECTROANALYTICAL CHEMISTRY

Simulation study of tertiary current distributions on rotating electrodes

(2012) L Z Tong   TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING

Effects of supporting electrolytes on copper electroplating for filling through-hole

(2011) Chien-Hung Chen et al.   ELECTROCHIMICA ACTA

Classification of suppressor additives based on synergistic and antagonistic ensemble effects

(2011) P. Broekmann et al.   ELECTROCHIMICA ACTA

Sensitivity Enhancement for Quantitative Electrochemical Determination of a Trace Amount of Accelerator in Copper Plating Solutions

(2011) Yong-Da Chiu et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Effect of Convection-Dependent Adsorption of Additives on Microvia Filling in an Acidic Copper Plating Solution

(2011) Su-Mei Huang et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Experimental and modeling analysis of the formation of cuprous intermediate species formed during the copper deposition on a rotating disk electrode

(2010) Jorge Vazquez-Arenas   ELECTROCHIMICA ACTA

Microvia filling by copper electroplating using diazine black as a leveler

(2009) Wei-Ping Dow et al.   ELECTROCHIMICA ACTA

Microvia Filling by Cu Electroplating Over a Au Seed Layer Modified by a Disulfide

(2009) Wei-Ping Dow et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Filling mechanism in microvia metallization by copper electroplating

(2008) Wei-Ping Dow et al.   ELECTROCHIMICA ACTA

Copper electrodeposition from an acidic plating bath containing accelerating and inhibiting organic additives

(2008) M.A. Pasquale et al.   ELECTROCHIMICA ACTA

A SERS study of the galvanostatic sequence used for the electrochemical deposition of copper from baths employed in the fabrication of interconnects

(2008) Lucia D’Urzo et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Through-Hole Filling by Copper Electroplating

(2008) Wei-Ping Dow et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

PEG, PPG, and Their Triblock Copolymers as Suppressors in Copper Electroplating

(2008) Joshua W. Gallaway et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

An ALE Model for Prediction and Control of the Microvia Fill Process with Two Additives

(2008) R. Tenno et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Enhancement of filling performance of a copper plating formula at low chloride concentration

(2007) Wei-Ping Dow et al.   ELECTROCHIMICA ACTA