CIRCUIT WORLD
Note: The following journal information is for reference only. Please check the journal website for updated information prior to submission.
Journal Title
CIRCUIT WORLD
CIRCUIT WORLD
ISSN / eISSN
0305-6120
Aims and Scope
Circuit World is a platform for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes.
Circuit World covers a broad range of topics, including:
• Circuit theory, design methodology, analysis and simulation
• Digital, analog, microwave and optoelectronic integrated circuits
• Semiconductors, passives, connectors and sensors
• Electronic packaging of components, assemblies and products
• PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes)
• Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal)
• Internet of Things (IoT).
Circuit World covers a broad range of topics, including:
• Circuit theory, design methodology, analysis and simulation
• Digital, analog, microwave and optoelectronic integrated circuits
• Semiconductors, passives, connectors and sensors
• Electronic packaging of components, assemblies and products
• PCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes)
• Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal)
• Internet of Things (IoT).
Subject Area
ENGINEERING, ELECTRICAL & ELECTRONIC
MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
2.10
View Trend
CiteScore Ranking
| Category | Quartile | Rank |
|---|---|---|
| Engineering - Industrial and Manufacturing Engineering | Q3 | #188/355 |
| Engineering - Electrical and Electronic Engineering | Q3 | #463/738 |
Web of Science Core Collection
| Science Citation Index Expanded (SCIE) | Social Sciences Citation Index (SSCI) |
|---|---|
| Indexed | - |
| Category (Journal Citation Reports 2023) | Quartile |
|---|---|
| ENGINEERING, ELECTRICAL & ELECTRONIC - SCIE | Q4 |
| MATERIALS SCIENCE, MULTIDISCIPLINARY - SCIE | Q4 |
H-index
19
Country/Area of Publication
ENGLAND
Publisher
Emerald Group Publishing Ltd.
Publication Frequency
Quarterly
Annual Article Volume
36
Open Access
NO
Contact
EMERALD GROUP PUBLISHING LIMITED, HOWARD HOUSE, WAGON LANE, BINGLEY, ENGLAND, W YORKSHIRE, BD16 1WA
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