Electrical Resistivity Modification of Electrodeposited Mo and Mo–Co Nanowires for Interconnect Applications

Metal selenides for energy storage and conversion: A comprehensive review

(2023) Dongliang Chen et al.   COORDINATION CHEMISTRY REVIEWS

Properties of ultrathin molybdenum films for interconnect applications

(2022) Valeria Founta et al.   Materialia

Engineering the shape of one-dimensional metallic nanostructures via nanopore electrochemistry

(2021) Yoo Sang Jeon et al.   Nano Today

Electrical resistivity evolution in electrodeposited Ru and Ru-Co nanowires

(2021) Jun Hwan Moon et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

AC Line Filter Electrochemical Capacitors: Materials, Morphology, and Configuration

(2021) Haichao Tang et al.   Energy & Environmental Materials

The search for the most conductive metal for narrow interconnect lines

(2020) Daniel Gall   JOURNAL OF APPLIED PHYSICS

First-Principles Evaluation of fcc Ruthenium for its use in Advanced Interconnects

(2020) Timothy M. Philip et al.   Physical Review Applied

Electrical resistivity and microstructural evolution of electrodeposited Co and Co-W nanowires

(2020) Eunmin Yoo et al.   MATERIALS CHARACTERIZATION

Opportunities and challenges of 2D materials in back-end-of-line interconnect scaling

(2020) Chun-Li Lo et al.   JOURNAL OF APPLIED PHYSICS

Potential of low-resistivity Cu2Mg for highly scaled interconnects and its challenges

(2020) Linghan Chen et al.   APPLIED SURFACE SCIENCE

QuantumATK: an integrated platform of electronic and atomic-scale modelling tools

(2019) Søren Smidstrup et al.   JOURNAL OF PHYSICS-CONDENSED MATTER

Co and CoTi x for contact plug and barrier layer in integrated circuits

(2018) Maryamsadat Hosseini et al.   MICROELECTRONIC ENGINEERING

Electrosynthesis of metallic molybdenum from water deficient solution containing molybdate ions and high concentrations of acetate

(2018) Siti Nur Hasan et al.   SURFACE & COATINGS TECHNOLOGY

Thickness dependence of the resistivity of platinum-group metal thin films

(2017) Shibesh Dutta et al.   JOURNAL OF APPLIED PHYSICS

Industrial-scale sputter deposition of molybdenum oxide thin films: Microstructure evolution and properties

(2017) Julia M. Pachlhofer et al.   JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A

Size effects and charge transport in metals: Quantum theory of the resistivity of nanometric metallic structures arising from electron scattering by grain boundaries and by rough surfaces

(2017) Raul C. Munoz et al.   Applied Physics Reviews

Electron mean free path in elemental metals

(2016) Daniel Gall   JOURNAL OF APPLIED PHYSICS

A study on the plating and wetting ability of ruthenium-tungsten multi-layers for advanced Cu metallization

(2016) Tai-Chen Kuo et al.   MICROELECTRONIC ENGINEERING

Interfacial double layer mediated electrochemical growth of thin-walled platinum nanotubes

(2016) Liqiu Zhang et al.   NANOTECHNOLOGY

The Mechanism of Schottky Barrier Modulation of Tantalum Nitride/Ge Contacts

(2015) Yujin Seo et al.   IEEE ELECTRON DEVICE LETTERS

Over-limiting Current and Control of Dendritic Growth by Surface Conduction in Nanopores

(2014) Ji-Hyung Han et al.   Scientific Reports

Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnects

(2012) Kuo-Chung Hsu et al.   APPLIED SURFACE SCIENCE

The deposition of smooth metallic molybdenum from aqueous electrolytes containing molybdate ions

(2011) Thomas J. Morley et al.   ELECTROCHEMISTRY COMMUNICATIONS

Robust ultra-thin RuMo alloy film as a seedless Cu diffusion barrier

(2011) Kuo-Chung Hsu et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Kinetics of Ni–Mo electrodeposition from Ni-rich citrate baths

(2011) E. Beltowska-Lehman et al.   THIN SOLID FILMS