Synthesis and microstructure of electrodeposited and sputtered nanotwinned face-centered-cubic metals

Optimization of strength and ductility in nanotwinned ultra-fine grained Ag: Twin density and grain orientations

(2015) R.T. Ott et al.   ACTA MATERIALIA

Copper thin films by ion beam assisted deposition: Strong texture, superior thermal stability and enhanced hardness

(2015) Huan Ma et al.   ACTA MATERIALIA

Strengthening high-stacking-fault-energy metals via parallelogram nanotwins

(2015) Yuefei Zhang et al.   SCRIPTA MATERIALIA

Damage-tolerant nanotwinned metals with nanovoids under radiation environments

(2015) Y. Chen et al.   Nature Communications

MICROSTRUCTURE DEPENDENCE OF DIRECT-CURRENT ELECTRODEPOSITED BULK Cu WITHPREFERENTIALLY ORIENTED NANOTWINSON THE CURRENT DENSITIES

(2015) Shuai JIN et al.   ACTA METALLURGICA SINICA

Quantitative damage and detwinning analysis of nanotwinned copper foil under cyclic loading

(2014) Byung-Gil Yoo et al.   ACTA MATERIALIA

Nanotwinned diamond with unprecedented hardness and stability

(2014) Quan Huang et al.   NATURE

Influence of stacking fault energy on twin spacing of Cu and Cu–Al alloys

(2014) Leonardo Velasco et al.   SCRIPTA MATERIALIA

In situ nanoindentation study on plasticity and work hardening in aluminium with incoherent twin boundaries

(2014) D. Bufford et al.   Nature Communications

On the mechanical performance and deformation of nanotwinned Ag

(2014) T. A. Furnish et al.   APL Materials

Basic criteria for formation of growth twins in high stacking fault energy metals

(2013) K. Y. Yu et al.   APPLIED PHYSICS LETTERS

Topological view of the thermal stability of nanotwinned copper

(2013) Thomas LaGrange et al.   APPLIED PHYSICS LETTERS

Stacking fault and partial dislocation dominated strengthening mechanisms in highly textured Cu/Co multilayers

(2013) Y. Liu et al.   INTERNATIONAL JOURNAL OF PLASTICITY

Thermal stability of twins and strengthening mechanisms in differently oriented epitaxial nanotwinned Ag films

(2013) Daniel Bufford et al.   JOURNAL OF MATERIALS RESEARCH

High temperature stabilization of nanocrystalline grain size: Thermodynamic versus kinetic strategies

(2013) Carl C. Koch et al.   JOURNAL OF MATERIALS RESEARCH

Defective twin boundaries in nanotwinned metals

(2013) Y. Morris Wang et al.   NATURE MATERIALS

Formation Mechanisms of High-density Growth Twins in Aluminum with High Stacking-Fault Energy

(2013) D. Bufford et al.   Materials Research Letters

Ultrastrong Mg Alloy via Nano-spaced Stacking Faults

(2013) W. W. Jian et al.   Materials Research Letters

Plastic anisotropy and associated deformation mechanisms in nanotwinned metals

(2012) Zesheng You et al.   ACTA MATERIALIA

Orientation-dependent hardness and strain rate sensitivity in nanotwin copper

(2012) J. C. Ye et al.   APPLIED PHYSICS LETTERS

A formation mechanism for ultra-thin nanotwins in highly textured Cu/Ni multilayers

(2012) Y. Liu et al.   JOURNAL OF APPLIED PHYSICS

Thermal stability of highly nanotwinned copper: The role of grain boundaries and texture

(2012) Yifu Zhao et al.   JOURNAL OF MATERIALS RESEARCH

Deformation mechanisms in nanotwinned metal nanopillars

(2012) Dongchan Jang et al.   Nature Nanotechnology

Texture-dependent twin formation in nanocrystalline thin Pd films

(2012) B. Wang et al.   SCRIPTA MATERIALIA

Work hardening of polycrystalline Cu with nanoscale twins

(2012) L. Lu et al.   SCRIPTA MATERIALIA

Eliminate Kirkendall voids in solder reactions on nanotwinned copper

(2012) Tao-Chi Liu et al.   SCRIPTA MATERIALIA

Detwinning, damage and crack initiation during cyclic loading of Cu samples containing aligned nanotwins

(2011) C.J. Shute et al.   ACTA MATERIALIA

Mechanical properties of highly textured Cu/Ni multilayers

(2011) Y. Liu et al.   ACTA MATERIALIA

Tensile behavior of columnar grained Cu with preferentially oriented nanoscale twins

(2011) Z.S. You et al.   ACTA MATERIALIA

Ultrahigh Strain Hardening in Thin Palladium Films with Nanoscale Twins

(2011) Hosni Idrissi et al.   ADVANCED MATERIALS

Manipulating the Crystallographic Texture of Nanotwinned Cu Films by Electrodeposition

(2011) Tsung-Cheng Chan et al.   CRYSTAL GROWTH & DESIGN

Deformation twinning in nanocrystalline materials

(2011) Y.T. Zhu et al.   PROGRESS IN MATERIALS SCIENCE

Detwinning mechanisms for growth twins in face-centered cubic metals

(2010) J. Wang et al.   ACTA MATERIALIA

High strength, epitaxial nanotwinned Ag films

(2010) D. Bufford et al.   ACTA MATERIALIA

The Influence of Specific Anion Adsorption on the Surface Roughness of Electrodeposited Polycrystalline Cu Films

(2010) N. Vasiljevic et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Stabilizing nanostructured materials by coherent nanotwins and their grain boundary triple junction drag

(2009) C. Saldana et al.   APPLIED PHYSICS LETTERS

Dislocation structures of Σ3 {112} twin boundaries in face centered cubic metals

(2009) J. Wang et al.   APPLIED PHYSICS LETTERS

Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale

(2009) K. Lu et al.   SCIENCE

Revealing the Maximum Strength in Nanotwinned Copper

(2009) L. Lu et al.   SCIENCE

Epitaxial nanotwinned Cu films with high strength and high conductivity

(2008) O. Anderoglu et al.   APPLIED PHYSICS LETTERS

Synthesis and corrosion property of pure Ni with a high density of nanoscale twins

(2008) Guozhe Meng et al.   ELECTROCHIMICA ACTA

Nanoscale growth twins in sputtered metal films

(2008) X. Zhang et al.   JOM

Structure and migration of (112) step on (111) twin boundaries in nanocrystalline copper

(2008) Luhua Xu et al.   JOURNAL OF APPLIED PHYSICS

Thermal stability of sputtered Cu films with nanoscale growth twins

(2008) O. Anderoglu et al.   JOURNAL OF APPLIED PHYSICS

Observation of Atomic Diffusion at Twin-Modified Grain Boundaries in Copper

(2008) K.-C. Chen et al.   SCIENCE

Mechanical deformation of high-purity sputter-deposited nano-twinned copper

(2008) A.M. Hodge et al.   SCRIPTA MATERIALIA

Pulse and pulse reverse plating—Conceptual, advantages and applications

(2007) M.S. Chandrasekar et al.   ELECTROCHIMICA ACTA