Thermal stability of highly nanotwinned copper: The role of grain boundaries and texture

Superior thermal stability of coherent twin boundaries in nanotwinned metals

(2012) X. Zhang et al.   SCRIPTA MATERIALIA

Detwinning, damage and crack initiation during cyclic loading of Cu samples containing aligned nanotwins

(2011) C.J. Shute et al.   ACTA MATERIALIA

Vacancies, twins, and the thermal stability of ultrafine-grained copper

(2011) C. Saldana et al.   APPLIED PHYSICS LETTERS

How Grain Growth Stops: A Mechanism for Grain-Growth Stagnation in Pure Materials

(2010) E. A. Holm et al.   SCIENCE

Survey of computed grain boundary properties in face-centered cubic metals: I. Grain boundary energy

(2009) David L. Olmsted et al.   ACTA MATERIALIA

Stabilizing nanostructured materials by coherent nanotwins and their grain boundary triple junction drag

(2009) C. Saldana et al.   APPLIED PHYSICS LETTERS

Strengthening Materials by Engineering Coherent Internal Boundaries at the Nanoscale

(2009) K. Lu et al.   SCIENCE

Revealing the Maximum Strength in Nanotwinned Copper

(2009) L. Lu et al.   SCIENCE

Thermal stability of sputtered Cu films with nanoscale growth twins

(2008) O. Anderoglu et al.   JOURNAL OF APPLIED PHYSICS

Nanotwin formation and its physical properties and effect on reliability of copper interconnects

(2008) Di Xu et al.   MICROELECTRONIC ENGINEERING

Mechanical deformation of high-purity sputter-deposited nano-twinned copper

(2008) A.M. Hodge et al.   SCRIPTA MATERIALIA