Eliminate Kirkendall voids in solder reactions on nanotwinned copper

Published 2012 View Full Article

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Title
Eliminate Kirkendall voids in solder reactions on nanotwinned copper
Authors
Keywords
-
Journal
SCRIPTA MATERIALIA
Volume 68, Issue 5, Pages 241-244
Publisher
Elsevier BV
Online
2012-10-23
DOI
10.1016/j.scriptamat.2012.10.024

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