Copper thin films by ion beam assisted deposition: Strong texture, superior thermal stability and enhanced hardness

Published 2015 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Copper thin films by ion beam assisted deposition: Strong texture, superior thermal stability and enhanced hardness
Authors
Keywords
Thin film, Ion beam processing, Defects, Microstructure, Hardness
Journal
ACTA MATERIALIA
Volume 98, Issue -, Pages 17-28
Publisher
Elsevier BV
Online
2015-07-12
DOI
10.1016/j.actamat.2015.07.013

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Find Funding. Review Successful Grants.

Explore over 25,000 new funding opportunities and over 6,000,000 successful grants.

Explore

Ask a Question. Answer a Question.

Quickly pose questions to the entire community. Debate answers and get clarity on the most important issues facing researchers.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.