Article
Engineering, Manufacturing
Md. Abu Mosa, Jeong Yeop Jo, Kye-Si Kwon
Summary: Aerosol jet printing (AJP) is widely used in additive manufacturing sectors due to its capability of micro-pattern printing on various surfaces. This study focuses on developing an AJP system with an internal rotary valve to eliminate the issues caused by the external shutter. A new flow rate control method is proposed for fast on-off control to achieve uniform printing.
ADDITIVE MANUFACTURING
(2023)
Review
Materials Science, Multidisciplinary
Christine Fisher, Lydia N. Skolrood, Kai Li, Pooran C. Joshi, Tolga Aytug
Summary: Aerosol-jet printing (AJP) is an emergent direct-write approach used for rapid and affordable manufacturing of microadditive energy-efficient sensors and printed electronics. AJP can print diverse materials with a wide range of ink viscosities (0.001-1 Pa s) including ceramics, metals, polymers, and biological matter. It enables the conformal printing of complex geometrical designs on nonplanar surfaces with high spatial resolution features (approximately 10 μm) and wide standoff distances (1-11 mm) between the nozzle and substrate.
ADVANCED MATERIALS TECHNOLOGIES
(2023)
Article
Multidisciplinary Sciences
Kacper Skarzynski, Jakub Krzeminski, Malgorzata Jakubowska, Marcin Sloma
Summary: Enhancement of silver nanoparticles ink for micro-scale printed electronics technique, Aerosol Jet Printing, by using cationic and non-ionic surfactants has shown promising features for application in modern electronics. The addition of surfactants not only improves electrical conductivity and printability but also reduces resistivity values significantly, making printed lines more uniform and patterns narrower.
SCIENTIFIC REPORTS
(2021)
Article
Engineering, Manufacturing
Alejandro Martinez-Acosta, Rebecca R. Tafoya, Stella A. Quinones, Ethan B. Secor
Summary: This paper presents the development of an aerosol jet printer using a low-cost 32-bit microcontroller with real-time operating system features, enabling robust synchronization of the motion system with various peripheral hardware devices for functional patterning. The printer demonstrates competitive performance with high-end commercial printing platforms for electronic inks, while maintaining a portable, modular, and versatile framework to support hybrid manufacturing capabilities.
ADDITIVE MANUFACTURING
(2021)
Article
Nanoscience & Nanotechnology
Nazli Turan, Mortaza Saeidi-Javash, Jiahao Chen, Minxiang Zeng, Yanliang Zhang, David B. Go
Summary: The passage discusses the application of atmospheric pressure nonthermal plasmas in sintering printed films, demonstrating the surface modifications achieved through nonthermal plasmas under ambient conditions. These results offer a new direction for future electronic device manufacturing, showcasing the potential of utilizing nonthermal plasmas for additive manufacturing on flexible and low-melting-point materials.
ACS APPLIED MATERIALS & INTERFACES
(2021)
Article
Materials Science, Multidisciplinary
Korine A. Ohiri, Nicholas M. Nowicki, Timothy J. Montalbano, Michael Presley, Nathan S. Lazarus
Summary: Electroplating of bulk metal copper on aerosol jetted inks significantly reduces electrical resistivity. Characterization of plating rate, resistivity, adhesion, and morphology of resulting deposits demonstrates the feasibility of this approach. High-strength soldering to the electroplated metal traces further showcases the capability of integrating soldered surface mount components with aerosol jet-printed electronics.
ADVANCED ENGINEERING MATERIALS
(2021)
Article
Automation & Control Systems
Daniel J. Thomas, Deepti Singh
Summary: This research investigates the use of aerosol-jet printing to manufacture microsized strain and creep sensors onto the surface of a complex Inconel 718 nozzle. The innovative manufacturing process generates an aerosol-jet printed sensing platform that integrates printed electronics, allowing for continuous condition monitoring. The development of a high-temperature platinum nano particle conductive ink capable of withstanding temperatures up to 1290°C is a key breakthrough. The microprinted creep sensors are rigorously tested, further enhancing the printing process. The manufacturing process developed during this research is a game-changer, with endless applications in high-temperature sensor technology. It offers a solution for continuous condition monitoring in rocket engine structures, greatly enhancing safety and performance.
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
(2023)
Article
Chemistry, Multidisciplinary
Brittany N. Smith, Peter Ballentine, James L. Doherty, Ryan Wence, Hansel Alex Hobbie, Nicholas X. Williams, Aaron D. Franklin
Summary: This study demonstrates the use of aerosol jet printing to create 3D graphene microstructures without any post-print processing, using water as the only solvent. These microstructures exhibit conductivity immediately after printing and can be printed in freestanding configurations. Adding these microstructures to sensor electrodes can enhance sensitivity.
Article
Chemistry, Analytical
Rebecca R. Tafoya, Michael A. Gallegos, Julia R. Downing, Livio Gamba, Bryan Kaehr, Eric N. Coker, Mark C. Hersam, Ethan B. Secor
Summary: This study investigates the conditions for using graphene inks in high-speed flexographic printing, revealing the impact of ink and process parameters on print quality and electrical properties of graphene electrodes. The characterization of printed patterns shows striations and dense graphene network. Additionally, the mechanical and environmental sensitivity of printed electrodes, particularly atmospheric response and thermal hysteresis, is examined.
Article
Chemistry, Multidisciplinary
Bhagyashree Mishra, Yihong Maggie Chen
Summary: The research focuses on improving the dielectric properties of a printed polymer material and applying these improvements to the fabrication of fully printed carbon nanotube-based thin-film transistors. The goal is to reduce the gate threshold voltage and hysteresis during device operation.
Article
Engineering, Electrical & Electronic
Muhammadeziz Tursunniyaz, Anna Meredith, Joseph Andrews
Summary: Aerosol jet printing is a simple, cost-efficient, and environmentally friendly method for patterning thin films with nanomaterial inks. This study demonstrates aerosol jet printed resistive temperature sensors with a temperature coefficient of resistance close to that of bulk silver. The overall sensitivity of the printed sensors can be modulated by controlling the thickness of the printed thin films. The response of the printed sensors to bending strain and humidity is also evaluated.
SENSORS AND ACTUATORS A-PHYSICAL
(2023)
Article
Materials Science, Multidisciplinary
Firas Alshatnawi, Mohammed Alhendi, El Mehdi Abbara, Rajesh Sivasubramony, Behnam Garakani, Emuobosan Enakerakpo, David Shaddock, Nancy Stoffel, Cathleen Hoel, Mark D. Poliks, Peter Borgesen
Summary: The reliability of aerosol jet printed gold thick films onto ceramic substrates was assessed at temperatures up to 750°C, and it was found that the electrical performance and mechanical strength remained stable and reliable.
ADVANCED ENGINEERING MATERIALS
(2023)
Review
Chemistry, Multidisciplinary
Mahsa K. Saghafi, Srivatsan K. Vasantham, Navid Hussain, George Mathew, Federico Colombo, Barbara Schamberger, Eric Pohl, Gabriel Cadilha Marques, Ben Breitung, Motomu Tanaka, Martin Bastmeyer, Christine Selhuber-Unkel, Ute Schepers, Michael Hirtz, Jasmin Aghassi-Hagmann
Summary: The field of bioelectronics aims to connect cells and biological tissues, and has recently been greatly advanced by the development of printable organic, inorganic, and biomaterials, as well as advanced digital printing technologies. Additive manufacturing and 3D printing methods offer new routes for the creation of hybrid bio-/inorganic devices. In this review, the current state and future prospects of printed electronics for interfacing with biological systems are discussed.
ADVANCED FUNCTIONAL MATERIALS
(2023)
Article
Materials Science, Multidisciplinary
Hilkiah Ako, Joseph 'Mahony, Helen Hughes, Peter Mcloughlin, Niall J. O. 'Reilly
Summary: This paper reports the first use of Aerosol Jet Printing (AJP) as an additive manufacturing technique for the fabrication of dissolving microneedle arrays. By studying critical process parameters, high-quality microneedles were successfully fabricated and demonstrated the ability to penetrate porcine skin samples. This breakthrough is of significant importance in the field of biopharmaceutical delivery.
APPLIED MATERIALS TODAY
(2023)
Review
Materials Science, Multidisciplinary
Hong Wei Tan, Yu Ying Clarrisa Choong, Che Nan Kuo, Hong Yee Low, Chee Kai Chua
Summary: In recent years, the 3D printed electronics technology has attracted significant attention from industries and researchers due to its unique features. This review provides an in-depth overview of the latest 3D electronic printing techniques, innovative practical technologies, and upcoming application trends in advanced functional materials for fabricating 3D printed electronics devices.
PROGRESS IN MATERIALS SCIENCE
(2022)
Article
Thermodynamics
Kevin D. Cole, Alex Riensche, Prahalada K. Rao
Summary: This work introduces a method for solving the heat equation using the spectral graph method, which is applicable to temperature defined at discrete points and described by a graph. The method utilizes eigenvectors and eigenvalues to solve the heat equation on the graph, eliminating the need for computationally intensive procedures in the finite element method. The method is extended to include boundary heat loss and physics-based edge weights, and a discrete Green's function is introduced for solutions under various heating conditions. The accuracy of the method is validated through comparison with analytical solutions and finite difference solutions.
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
(2022)
Article
Engineering, Mechanical
Yue Zhou, El Mehdi Abbara, Dayue Jiang, Arad Azizi, Mark D. Poliks, Fuda Ning
Summary: This study investigated the fatigue properties of curved-surface AlSi10Mg parts fabricated by powder bed fusion, revealing that parts with larger curvatures are more prone to tensile fatigue fracture, while parts with smaller curvatures exhibit better surface quality and smaller grain sizes. The research provides new insights into characterizing and quantifying the fatigue performance of metal parts with complex geometries, promoting their adoption in real industries.
RAPID PROTOTYPING JOURNAL
(2022)
Article
Nanoscience & Nanotechnology
Shan Yan, Dong K. Dinh, Guojun Shang, Shan Wang, Wei Zhao, Xin Liu, Richard Robinson, Jack P. Lombardi, Ning He, Susan Lu, Mark Poliks, Benjamin S. Hsiao, Ivan Gitsov, Chuan-Jian Zhong
Summary: This study demonstrates the creation of chemically responsive electro-functionality in nonconductive, hydrophobic, and free-contacted textile or fibrous network materials by embedding size-tunable gold nanoparticles and structurally sensitive dendrons as crosslinkers in an electrospun polymeric fibrous substrate. The resulting fibrous structure shows high sensitivity to molecular interactions and exhibits chemiresistive responses to vaporous alcohol molecules with different chain lengths and isomers. This approach utilizes the multifunctional tunability of the nano-filaments in a sensor array format, providing potential applications in breath and sweat sensing as well as environmental monitoring of air quality.
ACS APPLIED MATERIALS & INTERFACES
(2022)
Article
Materials Science, Multidisciplinary
Ziyad Smoqi, Benjamin D. Bevans, Aniruddha Gaikwad, James Craig, Alan Abul-Haj, Brent Roeder, Bill Macy, Jeffrey E. Shield, Prahalada Rao
Summary: The objective of this study is to reduce flaw formation in powder and laser-based additive manufacturing process by controlling the meltpool temperature through closed-loop control. The results demonstrate that parts built under closed-loop control have reduced porosity variation and consistent microstructure compared to parts built under open-loop conditions.
MATERIALS & DESIGN
(2022)
Article
Engineering, Manufacturing
Mohammed Alhendi, Firas Alshatnawi, El Mehdi Abbara, Rajesh Sivasubramony, Gurvinder Khinda, Ashraf I. Umar, Peter Borgesen, Mark D. Poliks, David Shaddock, Cathleen Hoel, Nancy Stoffel, Tommyhing-K. H. Lam
Summary: This study presents an additive manufacturing-based approach for fabricating electronic components for high temperature applications. Gold-based electrical structures were printed on 3D printed ceramic substrates using aerosol jet printing technique. The stability and adhesion of the printed gold structures were assessed at different temperatures.
ADDITIVE MANUFACTURING
(2022)
Article
Nanoscience & Nanotechnology
Saurabh Khuje, Firas Alshatnawi, Mohammed Alhendi, Jian Yu, Aaron Sheng, Yulong Huang, Cheng-Gang Zhuang, Jason Armstrong, Chi Zhou, Mark Poliks, Shenqiang Ren
Summary: This study reports the development of high-temperature copper-graphene conductors using additive manufacturing, which effectively prevents oxygen adsorption and migration, ensuring electric stability and reliability at high temperatures. The combination of graphene and alumina surface passivation provides passivation capabilities for flexible electronics operating under harsh conditions.
ADVANCED ELECTRONIC MATERIALS
(2023)
Article
Biochemistry & Molecular Biology
Logan M. Lawrence, Roozbeh (Ross) Salary, Virginia Miller, Anisha Valluri, Krista L. Denning, Shannon Case-Perry, Karim Abdelgaber, Shannon Smith, Pier Paolo Claudio, James B. Day
Summary: This study examines the in vitro osteo regenerative potential of polycaprolactone (PCL) tissue scaffolding fabricated via a three-dimensional (3D) additive manufacturing technology. The results show that the PCL scaffold has comparable cell-scaffold interactions and biocompatibility as allograft bone material. The study suggests that PCL scaffolds can be an alternative to allograft bone material for orthopedic injury repair.
INTERNATIONAL JOURNAL OF MOLECULAR SCIENCES
(2023)
Article
Engineering, Electrical & Electronic
Damanpreet Kaur, Riya Wadhwa, Yuchen Nisika, Yuchen Zhang, Poojan Indrajeet Kaswekar, Quinn Qiao, Anju D. Sharma, Mark Poliks, Mukesh Kumar
Summary: This study reports the band alignment modification of heterojunction formed between amorphous Ga2O3 and CdS. The annealed heterojunction device shows a reduction in dark current, enhanced photocurrent, and shorter response time. The changes at the interface due to annealing lead to a significant alteration in the band alignment and carrier dynamics, thereby completely altering the ultimate device performance.
ACS APPLIED ELECTRONIC MATERIALS
(2023)
Proceedings Paper
Engineering, Electrical & Electronic
Ashraf Umar, Mohamed Y. Abdelatty, Gurvinder S. Khinda, Mohammed Alhendi, Mark D. Poliks
Summary: This paper investigates the impact of trace profiles on the RF performance and proposes a simulation method. The results show that the thickness of the trace and printing imperfections affect insertion losses and impedance.
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)
(2022)
Proceedings Paper
Engineering, Electrical & Electronic
Dylan J. Richmond, Emuobosan Enakerakpo, Mohammed Alhendi, Peter McClure, Mark D. Poliks
Summary: Damage and defects in PCBA often lead to the disposal of expensive components. This study examines the use of aerosol jet printing and traditional engineering fluid dispensing as methods to repair damaged PCBAs.
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)
(2022)
Proceedings Paper
Engineering, Electrical & Electronic
Udara S. Somarathna, Mohammed Alhendi, Behnam Garakani, Mark D. Poliks, Darshana L. Weerawarne, Joseph Iannotti, Christopher J. Kapusta, Nancy Stoffel, Stephen G. Gonya
Summary: This paper investigates the reliability of all-printed vias on flexible polymer substrates. Through thermal shock testing, the experimental results show that the all-printed vias exhibit robustness and reliability in the temperature range of -55 to 125 degrees Celsius.
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)
(2022)
Proceedings Paper
Engineering, Electrical & Electronic
Andrew Stennermann, Dan Balder, Madhu Stennermann, Christopher Tabor, Nancy Stoffel, Riadh Al-Haidari, Behnam Garakani, Udara Somarathna El Medhi Abbara, Mohammed Alhendi, Mark Poliks
Summary: Stretchable electronic devices, comprised of soft and rigid electronic components, require robust electrical interconnections. Magnetically aligned anisotropic conductive epoxy (ACE) technology offers mechanically robust flex-to-flex and flex-to-rigid connections in flexible hybrid electronic applications.
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)
(2022)
Proceedings Paper
Engineering, Electrical & Electronic
Emuobosan Enakerakpo, Ashraf Umar, Mohammed Alhendi, Dylan Richmond, Mark D. Poliks, Tom Rovere, Stephen Gonya
Summary: In this paper, we present the in-situ performance of flexible microwave antennas under environmental stress conditions based on MIL-STD-810 testing standards for the first time. The flexible antennas showed robustness during the exposures to high and low temperatures, thermal shocks, temperature-humidity, and water immersion.
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)
(2022)
Proceedings Paper
Engineering, Electrical & Electronic
Riadh Al-Haidari, Behnam Garakani, Mohammed Alhendi, Udara S. Somarathna, Mark D. Poliks, Christopher E. Tabor, Michelle Yuen, Madhu Stemmermann, Nancy Stoffel
Summary: This study investigates the performance of magnetically aligned Anisotropic Conductive Epoxy (ACE) as a bonding material and its response to mechanical and environmental stresses. The ACE demonstrates robustness and low contact resistance, making it a promising option for integrating stretchable wearable electronics.
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)
(2022)
Proceedings Paper
Engineering, Electrical & Electronic
Firas Alshatnawi, Mohammed Alhendi, Riadh A. Al-Haidari, Rajesh S. Sivasubramony, El Mehdi Abbara, K. Udara Somarathna, Mark D. Poliks, Peter Borgesen, David M. Shaddock, Nancy Stoffel, Cathleen Hoel
Summary: This study addresses the challenges of high temperature interconnection in electronics and successfully develops three methods for interconnecting silicon die with ceramic substrates. The stability and durability of each interconnection structure are validated through various tests, demonstrating their effectiveness in high temperature environments.
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)
(2022)
