Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits
出版年份 2023 全文链接
标题
Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits
作者
关键词
-
出版物
JOURNAL OF ELECTRONIC PACKAGING
Volume 145, Issue 4, Pages -
出版商
ASME International
发表日期
2023-09-30
DOI
10.1115/1.4063541
参考文献
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