Microchannel heat sinks with nanofluids for cooling electronic components: Performance enhancement, challenges, and limitations
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Title
Microchannel heat sinks with nanofluids for cooling electronic components: Performance enhancement, challenges, and limitations
Authors
Keywords
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Journal
Thermal Science and Engineering Progress
Volume 37, Issue -, Pages 101608
Publisher
Elsevier BV
Online
2022-12-08
DOI
10.1016/j.tsep.2022.101608
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