Numerical survey on performance of hybrid NePCM for cooling of electronics: Effect of heat source position and heat sink inclination

Title
Numerical survey on performance of hybrid NePCM for cooling of electronics: Effect of heat source position and heat sink inclination
Authors
Keywords
-
Journal
Publisher
ASME International
Online
2020-12-23
DOI
10.1115/1.4049431

Ask authors/readers for more resources

Find the ideal target journal for your manuscript

Explore over 38,000 international journals covering a vast array of academic fields.

Search

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now