Application of TCE-PCM based heat sinks for cooling of electronic components: A review

Published 2016 View Full Article

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Title
Application of TCE-PCM based heat sinks for cooling of electronic components: A review
Authors
Keywords
Phase change material, Thermal conductivity enhancer, Fins, Nano particles, Metallic foams
Journal
RENEWABLE & SUSTAINABLE ENERGY REVIEWS
Volume 59, Issue -, Pages 550-582
Publisher
Elsevier BV
Online
2016-01-22
DOI
10.1016/j.rser.2015.12.238

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