Intermetallic Compound Formation Mechanisms for Cu-Sn Solid–Liquid Interdiffusion Bonding

Title
Intermetallic Compound Formation Mechanisms for Cu-Sn Solid–Liquid Interdiffusion Bonding
Authors
Keywords
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Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 41, Issue 9, Pages 2453-2462
Publisher
Springer Nature
Online
2012-04-05
DOI
10.1007/s11664-012-2060-3

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