A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
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Title
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints
Authors
Keywords
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Journal
INTERNATIONAL JOURNAL OF PLASTICITY
Volume 155, Issue -, Pages 103308
Publisher
Elsevier BV
Online
2022-04-13
DOI
10.1016/j.ijplas.2022.103308
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Note: Only part of the references are listed.- Multi-scale Crystal Viscoplasticity Approach for Estimating Anisotropic Steady-State Creep Properties of Single-Crystal SnAgCu Alloys
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- (2020) Sven Gustafson et al. Nature Communications
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- (2020) J. W. Xian et al. JOURNAL OF ELECTRONIC MATERIALS
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- (2020) Yilun Xu et al. JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS
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- (2019) Tianhong Gu et al. SCRIPTA MATERIALIA
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- (2018) Bo Chen et al. INTERNATIONAL JOURNAL OF PLASTICITY
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- (2018) Xiaochong Lu et al. INTERNATIONAL JOURNAL OF PLASTICITY
- A mechanistic modelling methodology for microstructure-sensitive fatigue crack growth
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- (2017) Luis A. Zepeda-Ruiz et al. NATURE
- Microscale deformation behavior of bicrystal boundaries in pure tin (Sn) using micropillar compression
- (2016) C. Shashank Kaira et al. ACTA MATERIALIA
- Multiscale modeling of the anisotropic transient creep response of heterogeneous single crystal SnAgCu solder
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- (2015) Bite Zhou et al. JOURNAL OF ELECTRONIC MATERIALS
- Crystal plasticity finite element study of deformation behavior in commonly observed microstructures in lead free solder joints
- (2014) Payam Darbandi et al. COMPUTATIONAL MATERIALS SCIENCE
- A stored energy criterion for fatigue crack nucleation in polycrystals
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- Lattice rotation caused by wedge indentation of a single crystal: Dislocation dynamics compared to crystal plasticity simulations
- (2014) Yunhe Zhang et al. JOURNAL OF THE MECHANICS AND PHYSICS OF SOLIDS
- The role of elastic anisotropy, length scale and crystallographic slip in fatigue crack nucleation
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- Microstructure-based modeling of the ageing effect on the deformation behavior of the eutectic micro-constituent in SnAgCu lead-free solder
- (2012) Milad Maleki et al. ACTA MATERIALIA
- Fatigue Reliability Analysis of Sn–Ag–Cu Solder Joints Subject to Thermal Cycling
- (2012) F. X. Che et al. IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY
- The physics of fatigue crack initiation
- (2012) Michael D. Sangid INTERNATIONAL JOURNAL OF FATIGUE
- On the Mutual Effect of Viscoplasticity and Interfacial Damage Progression in Interfacial Fracture of Lead-Free Solder Joints
- (2011) Milad Maleki et al. JOURNAL OF ELECTRONIC MATERIALS
- The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints
- (2011) Thomas R. Bieler et al. JOURNAL OF ELECTRONIC MATERIALS
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- (2008) R.S. Sidhu et al. METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE
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