4.7 Article

A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints

期刊

INTERNATIONAL JOURNAL OF PLASTICITY
卷 155, 期 -, 页码 -

出版社

PERGAMON-ELSEVIER SCIENCE LTD
DOI: 10.1016/j.ijplas.2022.103308

关键词

Crystal plasticity; Solder joints; SAC305; thermal fatigue; Microstructure; Multi-scale modelling

资金

  1. Engineering and Physical Sciences Research Council [EP/R018863/1, EP/R019207/1]
  2. Royal Academy of Engineering/Rolls-Royce research chair

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This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu solder joints. The crystallographic orientation and its role in fatigue damage have been studied systematically, providing optimal solder microstructural design for in-service thermomechanical fatigue.
This paper presents a multi-scale modelling approach to investigate the underpinning mechanisms of microstructure-sensitive damage of single crystal Sn-3Ag-0.5Cu (wt%, SAC305) solder joints of a Ball Grid Array (BGA) board assembly subject to thermal cycling. The multi-scale scheme couples board-scale modelling at the continuum macro-scale and individual solder modelling at the crystal micro-scale. Systematic studies of tin crystal orientation and its role in fatigue damage have been compared to experimental observations. Crystallographic orientation is examined with respect to damage development, providing evidence-based optimal solder microstructural design for in-service thermomechanical fatigue.

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