An Innovative Movement Mode of Friction and Wear Tester Worktable and Its Application in CMP

Effect of UV Radiation on Oxidation for Ru CMP

(2021) Chenwei Wang et al.   ECS Journal of Solid State Science and Technology

Effect of Conditioner Type and Downforce, and Pad Surface Micro-Texture on SiO2 Chemical Mechanical Planarization Performance

(2019) Jeffrey McAllister et al.   Micromachines

Model Friction Studies of Chemical Mechanical Planarization Using a Pin-on-Disk Tribometer

(2019) Catheryn L. Jackson et al.   TRIBOLOGY LETTERS

Viscoelastic behavior of polishing pad: Effects on edge roll-off during silicon wafer polishing

(2019) Urara Satake et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY

Effect of Conditioning Downforce and Pad Break-In Time on Pad Surface Micro-Texture

(2018) Jeffrey McAllister et al.   ECS Journal of Solid State Science and Technology

The role of interactions between abrasive particles and the substrate surface in chemical-mechanical planarization of Si-face 6H-SiC

(2017) Guomei Chen et al.   RSC Advances

Pad roughness evolution during break-in and its abrasion due to the pad-wafer contact in oxide CMP

(2013) Boris Vasilev et al.   MICROELECTRONIC ENGINEERING

Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography

(2009) T. Sun et al.   MICROELECTRONIC ENGINEERING