Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography

Published 2009 View Full Article

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Title
Investigating the effect of diamond size and conditioning force on chemical mechanical planarization pad topography
Authors
Keywords
-
Journal
MICROELECTRONIC ENGINEERING
Volume 87, Issue 4, Pages 553-559
Publisher
Elsevier BV
Online
2009-08-26
DOI
10.1016/j.mee.2009.08.007

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