Wafer map defect recognition based on deep transfer learning-based densely connected convolutional network and deep forest
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Title
Wafer map defect recognition based on deep transfer learning-based densely connected convolutional network and deep forest
Authors
Keywords
Semiconductor manufacturing, Wafer map defect, Transfer learning, Convolution neural network, Deep forest
Journal
ENGINEERING APPLICATIONS OF ARTIFICIAL INTELLIGENCE
Volume 105, Issue -, Pages 104387
Publisher
Elsevier BV
Online
2021-08-18
DOI
10.1016/j.engappai.2021.104387
References
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