Effects of punch geometry and grain size in micron scale compression molding of copper

Title
Effects of punch geometry and grain size in micron scale compression molding of copper
Authors
Keywords
Microscale compression molding (imprinting, embossing, coining), Punch geometry effect, Grain-size effect, Incomplete gap filling, Mechanical response
Journal
MATERIALS & DESIGN
Volume 206, Issue -, Pages 109807
Publisher
Elsevier BV
Online
2021-05-06
DOI
10.1016/j.matdes.2021.109807

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