Effects of punch geometry and grain size in micron scale compression molding of copper
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Title
Effects of punch geometry and grain size in micron scale compression molding of copper
Authors
Keywords
Microscale compression molding (imprinting, embossing, coining), Punch geometry effect, Grain-size effect, Incomplete gap filling, Mechanical response
Journal
MATERIALS & DESIGN
Volume 206, Issue -, Pages 109807
Publisher
Elsevier BV
Online
2021-05-06
DOI
10.1016/j.matdes.2021.109807
References
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