Scaling the response of microscale compression molding of elemental Cu in the presence of dynamic recrystallization

Published 2010 View Full Article

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Title
Scaling the response of microscale compression molding of elemental Cu in the presence of dynamic recrystallization
Authors
Keywords
-
Journal
ACTA MATERIALIA
Volume 58, Issue 7, Pages 2638-2645
Publisher
Elsevier BV
Online
2010-01-27
DOI
10.1016/j.actamat.2009.12.050

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