Effects of punch geometry and grain size in micron scale compression molding of copper
出版年份 2021 全文链接
标题
Effects of punch geometry and grain size in micron scale compression molding of copper
作者
关键词
Microscale compression molding (imprinting, embossing, coining), Punch geometry effect, Grain-size effect, Incomplete gap filling, Mechanical response
出版物
MATERIALS & DESIGN
Volume 206, Issue -, Pages 109807
出版商
Elsevier BV
发表日期
2021-05-06
DOI
10.1016/j.matdes.2021.109807
参考文献
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