Tin whiskers prefer to grow from the [001] grains in a tin coating on aluminum substrate

Scanning 3DXRD Measurement of Grain Growth, Stress, and Formation of Cu6Sn5 around a Tin Whisker during Heat Treatment

(2019) Johan Hektor et al.   Materials

Confining effect of oxide film on tin whisker growth

(2019) Yushuang Liu et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

The influence of the crystallographic structure of the intermetallic grains on tin whisker growth

(2019) Balázs Illés et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Creep Behaviors Along Characteristic Crystal Orientations of Sn and Sn-1.8Ag by Using Nanoindentation

(2019) P. J. Chiang et al.   JOM

Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films

(2019) Balázs Illés et al.   Materials

Evidence of 3D strain gradients associated with tin whisker growth

(2018) Johan Hektor et al.   SCRIPTA MATERIALIA

Growth behavior of tin whisker on SnAg microbump under compressive stress

(2018) Menglong Sun et al.   SCRIPTA MATERIALIA

Direct soldering of screen-printed Al-paste layer on back-side of silicon solar cell using SnAg solder

(2018) Weibing Guo et al.   MATERIALS LETTERS

Anisotropic thermal expansion of Ni 3 Sn 4 , Ag 3 Sn, Cu 3 Sn, Cu 6 Sn 5 and βSn

(2017) J.W. Xian et al.   INTERMETALLICS

Mitigation of tin whisker growth by inserting Ni nanocones

(2017) Menglong Sun et al.   MATERIALS CHARACTERIZATION

Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders

(2016) Limin Ma et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Spatial correlation between local misorientations and nanoindentation hardness in nickel-base alloy 690

(2016) Rickard R. Shen et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Methods for fast, reliable growth of Sn whiskers

(2016) M.J. Bozack et al.   SURFACE SCIENCE

Evolution of residual stress and qualitative analysis of Sn whiskers with various microstructures

(2015) Hao Chen et al.   JOURNAL OF MATERIALS SCIENCE

Spontaneous Growth of Metal Whiskers on Surfaces of Solids: A Review

(2015) Peigen Zhang et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Effect of Al on the microstructure and properties of Sn–0.7Cu solder alloy

(2015) Zhongmin Lai et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

Tin whisker growth from micro-alloyed SAC solders in corrosive climate

(2014) Balázs Illés et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of crystallographic texture, anisotropic elasticity, and thermal expansion on whisker formation in β-Sn thin films

(2014) Wei-Hsun Chen et al.   JOURNAL OF MATERIALS RESEARCH

Corrosion properties of tin–copper alloy coatings in aspect of tin whisker growth

(2013) Barbara Horváth et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation

(2013) Pylin Sarobol et al.   JOURNAL OF MATERIALS RESEARCH

Effects of Al and Fe additions on microstructure and mechanical properties of SnAgCu eutectic lead-free solders

(2013) A. Kantarcıoğlu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Microstructure and growth mechanism of tin whiskers on RESn3 compounds

(2012) Cai-Fu Li et al.   ACTA MATERIALIA

The effects of temperature and humidity on the growth of tin whisker and hillock from Sn5Nd alloy

(2012) Cai-Fu Li et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of Ni Content on Mechanical Properties and Corrosion Behavior of Al/Sn–9Zn–xNi/Cu Joints

(2012) M.L. Huang et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Microstructure design and dissolution behavior between 2024 Al/Sn with the ultrasonic-associated soldering

(2012) Yuanxing Li et al.   MATERIALS & DESIGN

In situ tensile creep behaviors of Sn–4Ag/Cu solder joints revealed by electron backscatter diffraction

(2012) Q.K. Zhang et al.   SCRIPTA MATERIALIA

Whisker growth on annealed and recrystallized tin platings

(2012) Barbara Horváth et al.   THIN SOLID FILMS

In situ investigation on the oxidation behavior of a RESn3 film by transmission electron microscopy

(2011) C.F. Li et al.   SCRIPTA MATERIALIA

Interface flow mechanism for tin whisker growth

(2010) H.P. Howard et al.   ACTA MATERIALIA

Defect Morphology and Texture in Sn, Sn–Cu, and Sn–Cu–Pb Electroplated Films

(2010) Pylin Sarobol et al.   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

Whisker growth from an electroplated zinc coating

(2010) Alongheng Baated et al.   JOURNAL OF MATERIALS RESEARCH

Orientation gradients and geometrically necessary dislocations in ultrafine grained dual-phase steels studied by 2D and 3D EBSD

(2010) Marion Calcagnotto et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

β-Sngrain-boundary structure and self-diffusivity via molecular dynamics simulations

(2010) Michael S. Sellers et al.   PHYSICAL REVIEW B

Mechanisms for Sn whisker growth in rare earth-containing Pb-free solders

(2009) M.A. Dudek et al.   ACTA MATERIALIA

Local, submicron, strain gradients as the cause of Sn whisker growth

(2009) M. Sobiech et al.   APPLIED PHYSICS LETTERS

Driving force for Sn whisker growth in the system Cu–Sn

(2008) M. Sobiech et al.   APPLIED PHYSICS LETTERS

Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes

(2008) E. Chason et al.   APPLIED PHYSICS LETTERS

Plastic deformation processes in Cu/Sn bimetallic films

(2008) K.S. Kumar et al.   JOURNAL OF MATERIALS RESEARCH