Effect of crystallographic texture, anisotropic elasticity, and thermal expansion on whisker formation in β-Sn thin films

Whisker and hillock growth via coupled localized Coble creep, grain boundary sliding, and shear induced grain boundary migration

(2013) P. Sarobol et al.   ACTA MATERIALIA

A Predictive Model for Whisker Formation Based on Local Microstructure and Grain Boundary Properties

(2013) P. Sarobol et al.   JOM

Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation

(2013) Pylin Sarobol et al.   JOURNAL OF MATERIALS RESEARCH

Recrystallization as a nucleation mechanism for whiskers and hillocks on thermally cycled Sn-alloy solder films

(2013) P. Sarobol et al.   MATERIALS LETTERS

Correlation Between Surface Morphology Evolution and Grain Structure: Whisker/Hillock Formation in Sn-Cu

(2012) Fei Pei et al.   JOM

Altering the Mechanical Properties of Sn Films by Alloying with Bi: Mimicking the Effect of Pb to Suppress Whiskers

(2012) Nitin Jadhav et al.   JOURNAL OF ELECTRONIC MATERIALS

Sn whisker growth during thermal cycling

(2011) Katsuaki Suganuma et al.   ACTA MATERIALIA

Understanding the Correlation Between Intermetallic Growth, Stress Evolution, and Sn Whisker Nucleation

(2010) Nitin Jadhav et al.   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

Defect Morphology and Texture in Sn, Sn–Cu, and Sn–Cu–Pb Electroplated Films

(2010) Pylin Sarobol et al.   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

Modelling Microstructures with OOF2

(2010) Andrew C.E. Reid et al.   INTERNATIONAL JOURNAL OF MATERIALS & PRODUCT TECHNOLOGY

Homology metrics for microstructure response fields in polycrystals

(2009) Thomas Wanner et al.   ACTA MATERIALIA

Finite Element Modeling of Stress Evolution in Sn Films due to Growth of the Cu6Sn5 Intermetallic Compound

(2009) Eric Buchovecky et al.   JOURNAL OF ELECTRONIC MATERIALS

Relation of Sn whisker formation to intermetallic growth: Results from a novel Sn–Cu “bimetal ledge specimen”

(2009) Lucine Reinbold et al.   JOURNAL OF MATERIALS RESEARCH

Driving force for Sn whisker growth in the system Cu–Sn

(2008) M. Sobiech et al.   APPLIED PHYSICS LETTERS

Whisker formation in Sn and Pb–Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes

(2008) E. Chason et al.   APPLIED PHYSICS LETTERS

Effective biaxial modulus and strain energy density of ideally (hkl)-fiber-textured hexagonal, tetragonal and orthorhombic films

(2008) Huaping Wu et al.   APPLIED SURFACE SCIENCE

Plastic deformation processes in Cu/Sn bimetallic films

(2008) K.S. Kumar et al.   JOURNAL OF MATERIALS RESEARCH