Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders

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Title
Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders
Authors
Keywords
Microstructure, POSS-silanol, Whisker formation, Composite solder
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 657, Issue -, Pages 400-407
Publisher
Elsevier BV
Online
2015-10-18
DOI
10.1016/j.jallcom.2015.09.266

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