Low-Temperature, Strong SiO2-SiO2 Covalent Wafer Bonding for III–V Compound Semiconductors-to-Silicon Photonic Integrated Circuits

Published 2008 View Full Article

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Title
Low-Temperature, Strong SiO2-SiO2 Covalent Wafer Bonding for III–V Compound Semiconductors-to-Silicon Photonic Integrated Circuits
Authors
Keywords
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Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 37, Issue 10, Pages 1552-1559
Publisher
Springer Nature
Online
2008-06-03
DOI
10.1007/s11664-008-0489-1

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