Effect of ultrasonic field on grain refinement and stress relaxation of Be films by thermal evaporation

Published 2020 View Full Article

  1. Home
  2. Publications
  3. Publication Search
  4. Publication Details
Title
Effect of ultrasonic field on grain refinement and stress relaxation of Be films by thermal evaporation
Authors
Keywords
-
Journal
Materials Science and Engineering B-Advanced Functional Solid-State Materials
Volume 253, Issue -, Pages 114436
Publisher
Elsevier BV
Online
2020-02-17
DOI
10.1016/j.mseb.2019.114436

Ask authors/readers for more resources

Protocol

Community support

Reagent

Community support

Reprint

Contact the author

Add your recorded webinar

Do you already have a recorded webinar? Grow your audience and get more views by easily listing your recording on Peeref.

Upload Now

Become a Peeref-certified reviewer

The Peeref Institute provides free reviewer training that teaches the core competencies of the academic peer review process.

Get Started
Webinars Posters Questions Hubs Funding Journals Articles Connect Collections Reviewers About Us FAQs Mobile App Privacy Policy Terms of Use
© Peeref 2019-2024. All rights reserved.