Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin
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Title
Kinetics of Ultrasonic and Current Coupling-Enhanced Dissolution of Copper in Liquid Tin
Authors
Keywords
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Journal
JOURNAL OF ELECTRONIC MATERIALS
Volume 49, Issue 11, Pages 6590-6597
Publisher
Springer Science and Business Media LLC
Online
2020-09-02
DOI
10.1007/s11664-020-08393-3
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