Homogeneous (Cu, Ni) 6 Sn 5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process
Homogeneous (Cu, Ni) 6 Sn 5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process
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