Effects of endogenous Al and Zn phases on mechanical properties of Sn58Bi eutectic alloy

Improvement of microstructure and tensile properties of Sn–Bi–Ag alloy by heterogeneous nucleation of β-Sn on Ag3Sn

(2020) Tianqi Yang et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Sn-3.0Ag-0.5Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology

(2019) Yu-An Shen et al.   MATERIALS & DESIGN

AlGaN-based UV-C distributed Bragg reflector with a λ-cavity designed for an external cavity structure electron-beam-pumped VCSEL

(2019) Y.R. Chen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of Bi on the microstructure and mechanical properties of Sn-Zn alloys processed by rolling

(2018) Guangyu Liu et al.   MATERIALS CHARACTERIZATION

Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy

(2018) Shiqi Zhou et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Microstructure, IMCs layer and reliability of Sn-58Bi solder joint reinforced by Mo nanoparticles during thermal cycling

(2018) Li Yang et al.   MATERIALS CHARACTERIZATION

Composition, Microstructure, Phase Constitution and Fundamental Physicochemical Properties of Low-Melting-Point Multi-Component Eutectic Alloys

(2017) Kaiyao Zhou et al.   JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY

Effects of nanoscale Cu 6 Sn 5 particles addition on microstructure and properties of SnBi solder alloys

(2017) Xuezheng Li et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Heterogeneous materials: a new class of materials with unprecedented mechanical properties

(2017) Xiaolei Wu et al.   Materials Research Letters

Growth mechanism of intermetallic compound and mechanical properties of nickel (Ni) nanoparticle doped low melting temperature tin–bismuth (Sn–Bi) solder

(2015) Asit Kumar Gain et al.   JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

A physical model revealing strong strain hardening in nano-grained metals induced by grain size gradient structure

(2015) Jianjun Li et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn–Bi-based solder alloys

(2014) Jun Shen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Microstructure and shear strength of Sn37Pb/Cu solder joints subjected to isothermal aging

(2014) Xiaowu Hu et al.   MICROELECTRONICS RELIABILITY

Extraordinary strain hardening by gradient structure

(2014) X. Wu et al.   PROCEEDINGS OF THE NATIONAL ACADEMY OF SCIENCES OF THE UNITED STATES OF AMERICA

The effect of increasing V content on the structure, mechanical properties and oxidation resistance of Ti–Si–V–N films deposited by DC reactive magnetron sputtering

(2013) F. Fernandes et al.   APPLIED SURFACE SCIENCE

Microstructure, Thermal and Wetting Properties of Sn-Bi-Zn Lead-Free Solder

(2013) Xu Chen et al.   JOURNAL OF ELECTRONIC MATERIALS

Low melting point liquid metal as a new class of phase change material: An emerging frontier in energy area

(2013) Haoshan Ge et al.   RENEWABLE & SUSTAINABLE ENERGY REVIEWS

Grain size gradient length scale in ballistic properties optimization of functionally graded nanocrystalline steel plates

(2013) Antoine Jérusalem et al.   SCRIPTA MATERIALIA

Elastic modulus, hardness and creep performance of SnBi alloys using nanoindentation

(2012) Lu Shen et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

On the relation between the microstructure and the mechanical behavior of pure Zn processed by high pressure torsion

(2012) B. Srinivasarao et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Harmonic and Random Vibration Durability of SAC305 and Sn37Pb Solder Alloys

(2010) Y Zhou et al.   IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES

First-principles calculations of vacancy–solute element interactions in body-centered cubic iron

(2009) Toshiharu Ohnuma et al.   ACTA MATERIALIA

Effect of La addition on the interfacial intermetallics and bonding strengths of Sn–58Bi solder joints with Au/Ni/Cu pads

(2009) Yu-Yun Shiue et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Thin layer in situ XRD of electrodeposited Ag/Sn and Ag/In for low-temperature isothermal diffusion soldering

(2008) Bernhard Gollas et al.   INTERMETALLICS

Effects of Trace Amounts of Rare Earth Additions on Microstructure and Properties of Sn-Bi-Based Solder Alloy

(2008) Wenxing Dong et al.   JOURNAL OF ELECTRONIC MATERIALS

Thermodynamic properties and phase equilibria of Sn–Bi–Zn ternary alloys

(2008) Ching-feng Yang et al.   MATERIALS CHEMISTRY AND PHYSICS

Tensile deformation and fracture behaviors of high purity polycrystalline zinc

(2008) J.H. Liu et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Tensile and compressive deformation behaviors of commercially pure Al processed by equal-channel angular pressing with different dies

(2008) J.W. Wang et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING