Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior
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Title
Fabrication of an IPL-sintered Cu circuit and its electrochemical migration behavior
Authors
Keywords
Cu nanopaste, Intensive pulsed light, Low-temperature sintering, Electrochemical migration
Journal
JOURNAL OF ALLOYS AND COMPOUNDS
Volume 863, Issue -, Pages 158726
Publisher
Elsevier BV
Online
2021-01-14
DOI
10.1016/j.jallcom.2021.158726
References
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