Printed highly conductive Cu films with strong adhesion enabled by low-energy photonic sintering on low-Tg flexible plastic substrate

Published 2016 View Full Article

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Title
Printed highly conductive Cu films with strong adhesion enabled by low-energy photonic sintering on low-Tg flexible plastic substrate
Authors
Keywords
-
Journal
NANOTECHNOLOGY
Volume 28, Issue 3, Pages 035203
Publisher
IOP Publishing
Online
2016-12-12
DOI
10.1088/1361-6528/28/3/035203

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