Cu Ion Ink for a Flexible Substrate and Highly Conductive Patterning by Intensive Pulsed Light Sintering

Published 2013 View Full Article

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Title
Cu Ion Ink for a Flexible Substrate and Highly Conductive Patterning by Intensive Pulsed Light Sintering
Authors
Keywords
-
Journal
ACS Applied Materials & Interfaces
Volume 5, Issue 10, Pages 4113-4119
Publisher
American Chemical Society (ACS)
Online
2013-04-16
DOI
10.1021/am303268k

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