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Title
Manifold microchannel heat sink topology optimisation
Authors
Keywords
Manifold, Microchannel, Heat sink, Electronics cooling, Topology optimisation
Journal
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 170, Issue -, Pages 121025
Publisher
Elsevier BV
Online
2021-02-07
DOI
10.1016/j.ijheatmasstransfer.2021.121025
References
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