Open manifold microchannel heat sink for high heat flux electronic cooling with a reduced pressure drop
Published 2020 View Full Article
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Title
Open manifold microchannel heat sink for high heat flux electronic cooling with a reduced pressure drop
Authors
Keywords
Manifold, Microchannel, Electronics cooling, Heat sink, Jet impingement
Journal
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 163, Issue -, Pages 120395
Publisher
Elsevier BV
Online
2020-09-23
DOI
10.1016/j.ijheatmasstransfer.2020.120395
References
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