Open manifold microchannel heat sink for high heat flux electronic cooling with a reduced pressure drop

Title
Open manifold microchannel heat sink for high heat flux electronic cooling with a reduced pressure drop
Authors
Keywords
Manifold, Microchannel, Electronics cooling, Heat sink, Jet impingement
Journal
INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER
Volume 163, Issue -, Pages 120395
Publisher
Elsevier BV
Online
2020-09-23
DOI
10.1016/j.ijheatmasstransfer.2020.120395

Ask authors/readers for more resources

Reprint

Contact the author

Discover Peeref hubs

Discuss science. Find collaborators. Network.

Join a conversation

Publish scientific posters with Peeref

Peeref publishes scientific posters from all research disciplines. Our Diamond Open Access policy means free access to content and no publication fees for authors.

Learn More