Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips

Title
Experimental Investigation of an Ultrathin Manifold Microchannel Heat Sink for Liquid-Cooled Chips
Authors
Keywords
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Journal
JOURNAL OF HEAT TRANSFER-TRANSACTIONS OF THE ASME
Volume 132, Issue 8, Pages 081402
Publisher
ASME International
Online
2010-06-12
DOI
10.1115/1.4001306

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