An analytical model for estimation of the stress field and cracks caused by scratching anisotropic single crystal gallium nitride

Nucleation location and propagation direction of radial and median cracks for brittle material in scratching

(2019) Xinying Li et al.   CERAMICS INTERNATIONAL

Nanotribological Properties of Ga- and N-Faced Bulk Gallium Nitride Surfaces Determined by Nanoscratch Experiments

(2019) Jian Guo et al.   Materials

Study on nucleation and propagation of median cracks generated by scratching single crystal silicon

(2019) Longxu Yao et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Stress analysis in scratching of anisotropic single-crystal silicon carbide

(2018) Peizhi Wang et al.   INTERNATIONAL JOURNAL OF MECHANICAL SCIENCES

Evaluation of subsurface damage inherent to polished GaN substrates using depth-resolved cathodoluminescence spectroscopy

(2018) Jinhyung Lee et al.   THIN SOLID FILMS

Subsurface Damage in Polishing Process of Silicon Carbide Ceramic

(2018) Yan Gu et al.   Materials

Insight into physical processes controlling the mechanical properties of the wurtzite group-III nitride family

(2018) I. Yonenaga et al.   JOURNAL OF CRYSTAL GROWTH

Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide

(2017) Peizhi Wang et al.   ENGINEERING FRACTURE MECHANICS

Material removal mechanism of 6H-SiC studied by nano-scratching with Berkovich indenter

(2016) Binbin Meng et al.   APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING

Evaluation of subsurface damage in GaN substrate induced by mechanical polishing with diamond abrasives

(2013) Hideo Aida et al.   APPLIED SURFACE SCIENCE

Deformation of silicon – Insights from microcompression testing at 25–500°C

(2011) S. Korte et al.   INTERNATIONAL JOURNAL OF PLASTICITY

Chemical Mechanical Polishing of Gallium Nitride with Colloidal Silica

(2011) Hideo Aida et al.   JOURNAL OF THE ELECTROCHEMICAL SOCIETY

Ultra-precision grinding

(2010) E. Brinksmeier et al.   CIRP ANNALS-MANUFACTURING TECHNOLOGY

Nanoscratch Characterization of GaN Epilayers on c- and a-Axis Sapphire Substrates

(2010) Meng-Hung Lin et al.   Nanoscale Research Letters

Experimental study on abrasive waterjet polishing for hard–brittle materials

(2009) H.T. Zhu et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

A quantitative analysis for the stress field around an elastoplastic indentation/contact

(2009) Gang Feng et al.   JOURNAL OF MATERIALS RESEARCH

Subsurface damage measurement of ground fused silica parts by HF etching techniques

(2009) J. Neauport et al.   OPTICS EXPRESS

Fabrication of 3-in GaN substrates by hydride vapor phase epitaxy using void-assisted separation method

(2007) Takehiro Yoshida et al.   JOURNAL OF CRYSTAL GROWTH

Relationship between subsurface damage and surface roughness of optical materials in grinding and lapping processes

(2007) Shengyi Li et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY