A comparative study on the growth behaviors of Sn whiskers and hillocks in a Sn-Al alloy coating under different environments

Scanning 3DXRD Measurement of Grain Growth, Stress, and Formation of Cu6Sn5 around a Tin Whisker during Heat Treatment

(2019) Johan Hektor et al.   Materials

The influence of the crystallographic structure of the intermetallic grains on tin whisker growth

(2019) Balázs Illés et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Creep Behaviors Along Characteristic Crystal Orientations of Sn and Sn-1.8Ag by Using Nanoindentation

(2019) P. J. Chiang et al.   JOM

Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films

(2019) Balázs Illés et al.   Materials

Basic creep modelling of aluminium

(2018) S. Spigarelli et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Evidence of 3D strain gradients associated with tin whisker growth

(2018) Johan Hektor et al.   SCRIPTA MATERIALIA

Growth behavior of tin whisker on SnAg microbump under compressive stress

(2018) Menglong Sun et al.   SCRIPTA MATERIALIA

Co-electrodeposition of tin with 0.2–20% indium: Implications on tin whisker growth

(2018) S. Das Mahapatra et al.   SURFACE & COATINGS TECHNOLOGY

Direct soldering of screen-printed Al-paste layer on back-side of silicon solar cell using SnAg solder

(2018) Weibing Guo et al.   MATERIALS LETTERS

Effects of Static Heat and Dynamic Current on Al/Zn∙Cu/Sn Solder/Ag Interfaces of Sn Photovoltaic Al-Ribbon Modules

(2018) Kuan-Jen Chen et al.   Materials

Anisotropic thermal expansion of Ni 3 Sn 4 , Ag 3 Sn, Cu 3 Sn, Cu 6 Sn 5 and βSn

(2017) J.W. Xian et al.   INTERMETALLICS

Role of surface oxide in mitigating tin whisker growth: A finite element study

(2017) S. Das Mahapatra et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Intermetallic compounds in solar cell interconnections: Microstructure and growth kinetics

(2017) Torsten Geipel et al.   SOLAR ENERGY MATERIALS AND SOLAR CELLS

Whisker growth behaviors in POSS-silanol modified Sn3.0Ag0.5Cu composite solders

(2016) Limin Ma et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Eliminating Whisker Growth by Indium Addition in Electroplated Sn on Copper Substrate

(2016) S. Das Mahapatra et al.   JOURNAL OF ELECTRONIC MATERIALS

Mechanical deformation behavior and mechanism of Sn-58Bi solder alloys under different temperatures and strain rates

(2016) Xu Chen et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Spatial correlation between local misorientations and nanoindentation hardness in nickel-base alloy 690

(2016) Rickard R. Shen et al.   MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING

Double-layered Ag–Al back reflector on stainless steel substrate for a-Si:H thin film solar cells

(2016) Kwang Hoon Jung et al.   SOLAR ENERGY MATERIALS AND SOLAR CELLS

Methods for fast, reliable growth of Sn whiskers

(2016) M.J. Bozack et al.   SURFACE SCIENCE

Whisker Growth Behavior of Sn58Bi Solder Coatings Under Isothermal Aging

(2015) Limin Ma et al.   JOURNAL OF ELECTRONIC MATERIALS

Quantifying the Rates of Sn Whisker Growth and Plastic Strain Relaxation Using Thermally-Induced Stress

(2015) Fei Pei et al.   JOURNAL OF ELECTRONIC MATERIALS

Tin whisker growth from micro-alloyed SAC solders in corrosive climate

(2014) Balázs Illés et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Effect of crystallographic texture, anisotropic elasticity, and thermal expansion on whisker formation in β-Sn thin films

(2014) Wei-Hsun Chen et al.   JOURNAL OF MATERIALS RESEARCH

Creep behaviour of eutectic SnBi alloy and its constituent phases using nanoindentation technique

(2013) Lu Shen et al.   JOURNAL OF ALLOYS AND COMPOUNDS

Corrosion properties of tin–copper alloy coatings in aspect of tin whisker growth

(2013) Barbara Horváth et al.   JOURNAL OF ALLOYS AND COMPOUNDS

In situ tensile creep behaviors of Sn–4Ag/Cu solder joints revealed by electron backscatter diffraction

(2012) Q.K. Zhang et al.   SCRIPTA MATERIALIA

Whisker growth on annealed and recrystallized tin platings

(2012) Barbara Horváth et al.   THIN SOLID FILMS

Large-scale 3D random polycrystals for the finite element method: Generation, meshing and remeshing

(2011) R. Quey et al.   COMPUTER METHODS IN APPLIED MECHANICS AND ENGINEERING

Defect Morphology and Texture in Sn, Sn–Cu, and Sn–Cu–Pb Electroplated Films

(2010) Pylin Sarobol et al.   IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING

Whisker growth from an electroplated zinc coating

(2010) Alongheng Baated et al.   JOURNAL OF MATERIALS RESEARCH

Investigation of relation between intermetallic and tin whisker growths under ambient condition

(2007) K.S. Kim et al.   MICROELECTRONICS RELIABILITY