4.6 Article

Room-temperature deposition of a poling-free ferroelectric AlScN film by reactive sputtering

Journal

APPLIED PHYSICS LETTERS
Volume 118, Issue 8, Pages -

Publisher

AMER INST PHYSICS
DOI: 10.1063/5.0035335

Keywords

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Funding

  1. Center for the Semiconductor Technology Research from The Featured Areas Research Center Program
  2. Ministry of Science and Technology, Taiwan [MOST 109-2634-F-009-029]

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The crystallographic characteristics and ferroelectric properties of 50nm-thick sputter-deposited Al0.78Sc0.22N films deposited at room temperature and 400 degrees C were investigated. It was found that the films grew in the c-axis direction and exhibited poling-free ferroelectric properties. Despite low switching cycle endurance, metal-ferroelectric-metal capacitors showed high remnant polarization suitable for different deposition temperatures.
Crystallographic characterization and the ferroelectric properties of 50nm-thick sputter-deposited Al0.78Sc0.22N films deposited at room temperature (RT) and 400 degrees C are investigated. c-axis oriented growths were confirmed by x-ray diffraction patterns with rocking curve measurements for both samples. Al0.78Sc0.22N films were found to grow in the c-axis direction and showed poling-free ferroelectric properties, which are advantageous for practical memory and piezoelectric applications. Although the metal-ferroelectric-metal (MFM) capacitors represent low switching cycle endurance, MFM capacitors revealed remnant polarization (P-r) of 70 mu C/cm(2) and 113 mu C/cm(2) for RT- and 400 degrees C-deposited samples, respectively. Ferroelectric films with low-temperature process capability can open a wide range of applications.

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