Prediction of critical undeformed chip thickness for ductile mode to brittle transition in the cutting of single-crystal silicon

Study on nucleation and propagation of median cracks generated by scratching single crystal silicon

(2019) Longxu Yao et al.   MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Study on ductile mode machining of single-crystal silicon by mechanical machining

(2017) Dae-Hee Choi et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

On the cracks self-healing mechanism at ductile mode cutting of silicon

(2014) A.M. Kovalchenko et al.   TRIBOLOGY INTERNATIONAL

A model to predict the critical undeformed chip thickness in vibration-assisted machining of brittle materials

(2013) Xinquan Zhang et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Critical cutting thickness in ultra-precision machining of single crystal silicon

(2012) Minghai Wang et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

A review on the current research trends in ductile regime machining

(2012) Wee Keong Neo et al.   INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

A predictive model of the critical undeformed chip thickness for ductile–brittle transition in nano-machining of brittle materials

(2012) Muhammad Arif et al.   INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE

Influence of indenter angle on cracking in Si and Ge during nanoindentation

(2008) Jae-il Jang et al.   ACTA MATERIALIA

Predictive modeling of transition undeformed chip thickness in ductile-regime micro-machining of single crystal brittle materials

(2008) Siva Venkatachalam et al.   JOURNAL OF MATERIALS PROCESSING TECHNOLOGY

Fundamental investigation of subsurface damage in single crystalline silicon caused by diamond machining

(2008) Jiwang Yan et al.   PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY