Atomistic simulation of diffusion bonding of dissimilar materials undergoing ultrasonic welding
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Title
Atomistic simulation of diffusion bonding of dissimilar materials undergoing ultrasonic welding
Authors
Keywords
Molecular dynamics, Diffusion bonding, Ultrasonic welding, Dissimilar materials, Interface, EAM potential
Journal
INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY
Volume -, Issue -, Pages -
Publisher
Springer Nature
Online
2019-03-26
DOI
10.1007/s00170-019-03582-9
References
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